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首页> 外文期刊>Journal of Electron Microscopy >Variations in contrast of scanning electron microscope images for microstructure analysis of Si-based semiconductor materials
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Variations in contrast of scanning electron microscope images for microstructure analysis of Si-based semiconductor materials

机译:硅基半导体材料微观结构分析用扫描电子显微镜图像的对比度变化

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摘要

Image contrasts of Si-based semiconducting materials have been investigated by using the latest scanning electron microscope with various detectors under a range of experimental conditions. Under a very low accelerating voltage (500 V), we obtained a good image contrast between crystalline SiGe whiskers and the amorphous matrix using an in-lens secondary electron (SE) detector, while the conventional topographic SE image and the compositional backscattered electron (BSE) image gave no distinct contrast. By using an angular-selective BSE (AsB) detector for wide-angle scattered BSE, on the other hand, the crystal grains in amorphous matrix can be clearly visualized as ‘channelling contrast’. The image contrast is very similar to that of their transmission electron microscope image. The in-lens SE (true SE ≒ SE1) and the AsB (channelling) contrasts are quite useful to distinguish crystalline parts from amorphous ones.
机译:通过使用最新的扫描电子显微镜和各种检测器,在一系列实验条件下,研究了硅基半导体材料的图像对比度。在极低的加速电压(500 V)下,我们使用透镜内二次电子(SE)检测器获得了结晶SiGe晶须和非晶基质之间的良好图像对比度,而常规的地形SE图像和成分背散射电子(BSE) )图像没有明显的对比。另一方面,通过将角度选择BSE(AsB)检测器用于广角散射BSE,可以清晰地将非晶基质中的晶粒可视化为“通道对比度”。图像对比度与透射电子显微镜图像非常相似。镜头内SE(真实SE≒SE1)和AsB(通道化)对比对于区分晶体部分和非晶部分非常有用。

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