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Characteristics of in-situ phosphorus-doped silicon selective epitaxial growth at atmospheric pressure

机译:大气压下原位掺磷硅的选择性外延生长特性

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The characteristics of in-situ P-doped Si selective epitaxial growth (SEG) under atmospheric pressure (AP) was investigated and compared with in-situ As-doped SEG under AP. Dopant concentrations and growth rates of films grown at AP are higher than those at low pressure, this for both dopants. This was interpreted as effects of surface segregation of the dopant atoms and the strong etching effect of HCl during the SEG under AP. By optimizing the growth rate and temperature, we achieved a high dopant concentration of 7.3 × 10~(19) atoms/cm~3 and a high growth rate for the P-doped SEG.
机译:研究了大气压(AP)下原位掺P的Si选择性外延生长(SEG)的特性,并与AP下原位掺As的SEG进行了比较。在AP处生长的膜的掺杂剂浓度和生长速率高于低压下的掺杂剂浓度和生长速率,这对于两种掺杂剂都是如此。这被解释为在AP下SEG期间,掺杂剂原子的表面偏析和HCl的强蚀刻作用。通过优化生长速率和温度,我们实现了7.3×10〜(19)原子/ cm〜3的高掺杂浓度和P掺杂SEG的高生长速率。

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