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Excess Noise in Metal-Dielectric-Semiconductor Structures

机译:金属-电介质-半导体结构中的过多噪声

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Excess noise in metal-dielectric-semiconductor (MDS) capacitors is investigated in the cases when the device contains either planar or relief dielectric used as an insulation of the elements in modern microcircuits. The nature of the noise initiated in the structures with high and negligible leakage currents as well as in the structures with thin (the layer thickness is about 10-100 nm) and ultrathin (2-5 nm) dielectric is studied. The influence of the material of the material of the gate on the excess noise is revealed. The excess noise in the considered structures can be caused by physical processes on the dielectric-semiconductor and metal-dielectric phase interfaces, the mechanisms of the dielectric current flow, and the generation-recombination (GR) processes in the space-charge region (SCR) of the semiconductor. The influence of the γ-radiation treatment of the MDS structures on the excess noise level is investigated in different operation modes. The obtained results show that the excess noise is a sensitive diagnostic tool for the quality of the MDS structure.
机译:当设备包含平面或浮雕电介质作为现代微电路中元件的绝缘时,将研究金属电介质半导体(MDS)电容器中的过多噪声。研究了在具有高且可忽略的泄漏电流的结构中以及在薄(层厚度约为10-100 nm)和超薄(2-5 nm)电介质的结构中引发的噪声的性质。揭示了栅极材料的材料对过量噪声的影响。考虑的结构中的多余噪声可能是由介电半导体和金属介电相界面上的物理过程,介电电流的流动机理以及空间电荷区(SCR)中的生成复合(GR)过程引起的)。在不同的工作模式下,研究了MDS结构的γ辐射处理对过剩噪声水平的影响。获得的结果表明,多余的噪声对于MDS结构的质量是灵敏的诊断工具。

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