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Industrial technology for mass production of SnO_2 nanoparticles and PbO_2 microcube/microcross structures from electronic waste

机译:利用电子废物大规模生产SnO_2纳米颗粒和PbO_2微立方/微交叉结构的工业技术

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Waste Printed Circuit Boards (WPCBs) are one of the major recycling challenges in this century with Through-Hole Solder Joint (THSJ) components representing more than 40 wt% of their metallic fraction. THSJs are composed mainly of three metals - Cu, Sn, and Pb; in addition, THSJs can contain a very small amount of Pd and other additives such as Ni, Fe, 111, etc. Recently, dissolution treatment has successfully been used to liberate THSJs as received as well as copper foils, contacts, and tracks. In order to close the lifecycle loop of WPCB metallic fraction, this research has an aim to recover Sn and Pb from the liberated THSJs in the form of SnO2 nanoparticles and PbO2 micro cross/cubic structures as high added-value products using sustainable leaching technique. Nitric Acid was employed to prepare leaching solution, whereas ultrasound treatment was used to precipitate SnO2 and PbO2 precursor from the solution. With time, particles of other metals (Pd, Ni, Fe, Al, etc.) started to precipitate, acting as catalysts (or doping agents) and increasing the precipitation of SnO2 and PbO2. Under the effect of sound waves, temperature, and catalysts, SnO2 and PbO2 precursors transformed into nanoparticles and micro cross/cubic structures; formation and refining degree of these structures was controlled by changing the treatment time. Micro-filtration process was used to separate SnO2 nanoparticles from PbO2 microstructures. Also, copper was recovered from the remaining acidic solution as a Cu(OH)(2) by neutralization with NaOH at pH 8. SEM-EDS, TEM, FTIR, XRD, and ICP were used to examine the extracted THSJs, produced nano/micro products and recovered metals. The results showed that the SnO2 and PbO2 had average sizes of 7 nm and 1 pm respectively, while the preparation costs were 6 times lower in comparison to the commercial counterparts. Finally, the authors suggested a layout for applying the developed approach on an industrial scale while referring to the concepts of Circular Economy and Sustainable Development. (C) 2018 Elsevier Ltd. All rights reserved.
机译:废印刷电路板(WPCB)是本世纪的主要回收挑战之一,全孔焊点(THSJ)组件占其金属份额的40%以上。 THSJs主要由三种金属组成:Cu,Sn和Pb。此外,THSJ可以包含非常少量的Pd和其他添加剂,例如Ni,Fe,111等。最近,溶解处理已成功用于释放THSJ以及铜箔,触点和走线。为了封闭WPCB金属零件的生命周期循环,本研究旨在使用可持续浸出技术从释放的THSJ中以SnO2纳米颗粒和PbO2微十字/立方结构的形式回收锡和铅,作为高附加值产品。硝酸用于制备浸出溶液,而超声处理则用于从溶液中沉淀出SnO2和PbO2前体。随着时间的流逝,其他金属(Pd,Ni,Fe,Al等)的颗粒开始沉淀,充当催化剂(或掺杂剂)并增加SnO2和PbO2的沉淀。在声波,温度和催化剂的作用下,SnO2和PbO2前体转变为纳米颗粒和微十字/立方结构。通过改变处理时间来控制这些结构的形成和细化程度。微滤工艺用于从PbO2微观结构中分离出SnO2纳米颗粒。此外,通过用pH 8的NaOH中和,从残留的酸性溶液中以Cu(OH)(2)的形式回收铜。使用SEM-EDS,TEM,FTIR,XRD和ICP检查萃取的THSJs,生成的纳米/微型产品和回收金属。结果表明,SnO2和PbO2的平均粒径分别为7 nm和1 pm,而制备成本则比市售同类产品低6倍。最后,作者提出了一种布局方案,以在参考循环经济和可持续发展的概念的同时,将已发展的方法应用于工业规模。 (C)2018 Elsevier Ltd.保留所有权利。

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