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Electrical Behavior of Copper‐Diffused Insulating Layers on CdS Crystals

机译:CdS晶体上铜扩散绝缘层的电学行为

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Insulating CdS layers are formed on conducting CdS crystals by diffusion of copper. The layers are 1–10 μm thick and have resistivity of 108 Ω·cm. The layer thickness as determined from capacitance measurements does not depend on the applied voltage. Current‐voltage curves have Ohmic and square‐law regions in fields below 104 V/cm, and thereafter, they rise very steeply (j∝V5). Breakdown occurs at average fields of 5×105 V/cm. Pulsing to 105 V/cm greatly reduces the low‐field resistance, frequently increasing the capacitance; this is shown to be due to a peripheral expansion of the diffused layer together with a formation of breakdown channels. Field‐controlled freeing of carriers from traps is indicated by the rise of current with time at voltages above threshold, while below threshold the current pulse is decaying, due to trapping. Observations made along and perpendicular to c axis are similar.
机译:通过铜的扩散在导电CdS晶体上形成绝缘CdS层。这些层的厚度为1–10μm,电阻率为108Ω·cm。由电容测量确定的层厚度不取决于施加的电压。电流-电压曲线在低于104 V / cm的场中具有欧姆和平方律区域,此后,它们会急剧上升(j∝V5)。击穿发生在5×105 V / cm的平均电场下。脉冲电压达到105 V / cm可以大大降低低场电阻,从而经常增加电容。这表明是由于扩散层的周边膨胀以及击穿通道的形成。在阈值以上的电压下,电流随时间的上升而指示出场控载流子从阱中的释放,而在阈值以下,由于陷获,电流脉冲正在衰减。沿c轴和垂直于c轴的观察结果相似。

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    《Journal of Applied Physics 》 |1968年第1期| 共4页
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  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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