Activation energy for electromigration failure in Al–Cu conductor stripes covered with polyimide

摘要

The activation energy for electromigration failure was determined for Al‐4% Cu conductor stripes covered with polyimide. The activation energy was measured to be 0.88 eV, which is substantially higher than that measured previously for similar systems under glass. The difference in the activation energies is attributed to the possible presence of hydrogen in the Al–Cu grain boundaries.