...
首页> 外文期刊>Journal of Applied Physics >Abnormal threshold voltage shift under hot carrier stress in Ti1-xNx/HfO2 p-channel metal-oxide-semiconductor field-effect transistors
【24h】

Abnormal threshold voltage shift under hot carrier stress in Ti1-xNx/HfO2 p-channel metal-oxide-semiconductor field-effect transistors

机译:Ti1-xNx / HfO2 p沟道金属氧化物半导体场效应晶体管在热载流子应力作用下的异常阈值电压偏移

获取原文
获取原文并翻译 | 示例
           

摘要

This work investigates the channel hot carrier (CHC) effect in HfO2/Ti1-xNx p-channel metal oxide semiconductor field effect transistors (p-MOSFETs). Generally, the subthreshold swing (S.S.) should increase during CHC stress (CHCS), since interface states will be generated near the drain side under high electric field due to drain voltage (Vd). However, our experimental data indicate that S.S. has no evident change under CHCS, but threshold voltage (Vth) shifts positively. This result can be attributed to hot carrier injected into high-k dielectric near the drain side. Meanwhile, it is surprising that such Vth degradation is not observed in the saturation region during stress. Therefore, drain-induced-barrier-lowering (DIBL) as a result of CHC-induced electron trapping is proposed to explain the different Vth behaviors in the linear and saturation regions. Additionally, the influence of different nitrogen concentrations in HfO2/Ti1-xNx p-MOSFETs on CHCS is also investigated in this work. Since nitrogen diffuses to SiO2/Si interface induced pre-Nit occurring to degrades channel mobility during the annealing process, a device with more nitrogen shows slightly less impact ionization, leading to insignificant charge trapping-induced DIBL behavior.
机译:这项工作研究HfO 2 / Ti 1-x N x p沟道金属氧化物半导体场效应中的沟道热载流子(CHC)效应晶体管(p-MOSFET)。通常,在CHC应力(CHCS)期间,亚阈值摆幅(S.S.)应该增加,因为在高电场下,由于漏极电压(V d )将在漏极侧附近产生界面状态。但是,我们的实验数据表明,在CHCS下,S.S。没有明显变化,但是阈值电压(V th )正向移动。该结果可以归因于热载流子注入到漏极侧附近的高k电介质中。同时,令人惊讶的是,在应力作用下在饱和区中未观察到这种Vthinf降解。因此,提出了CHC诱导电子俘获的漏极诱导势垒降低(DIBL)来解释线性和饱和区域中不同的Vth inf行为。此外,本研究还研究了HfO 2 / Ti 1-x N x p-MOSFET中不同氮浓度对CHCS的影响。 。由于氮扩散到SiO 2 / Si界面诱导的pre-N 发生,从而降低了退火过程中的通道迁移率,因此氮含量较高的器件显示出的冲击电离略少,导致微不足道的电荷陷阱诱导的DIBL行为。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号