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Modeling tunnel field effect transistors-From interface chemistry to non-idealities to circuit level performance

机译:建模隧道场效应晶体管-从界面化学到非理想性再到电路级性能

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摘要

We present a quasi-analytical model for Tunnel Field Effect Transistors (TFETs) that includes the microscopic physics and chemistry of interfaces and non-idealities. The ballistic band-to-band tunneling current is calculated by modifying the well known Simmons equation for oxide tunneling, where we integrate the Wentzel-Kramers-Brillouin tunneling current over the transverse modes. We extend the Simmons equation to finite temperature and non-rectangular barriers using a two-band model for the channel material and an analytical channel potential profile obtained from Poisson's equation. The two-band model is parametrized first principles by calibrating with hybrid Density Functional Theory calculations and extended to random alloys with a band unfolding technique. Our quasi-analytical model shows quantitative agreement with ballistic quantum transport calculations. On top of the ballistic tunnel current, we incorporate higher order processes arising at junctions coupling the bands, specifically interface trap assisted tunneling and Auger generation processes. Our results suggest that both processes significantly impact the off-state characteristics of the TFETs-Auger, in particular, being present even for perfect interfaces. We show that our microscopic model can be used to quantify the TFET performance on the atomistic interface quality. Finally, we use our simulations to quantify circuit level metrics such as energy consumption. Published by AIP Publishing.
机译:我们提出了隧道场效应晶体管(TFET)的准分析模型,其中包括界面和非理想性的微观物理和化学性质。弹道带间隧穿电流是通过修改众所周知的用于氧化物隧穿的Simmons方程来计算的,在该方程中,我们将Wentzel-Kramers-Brillouin隧穿电流整合到横向模式中。我们使用两带模型的通道材料和从泊松方程获得的分析通道电势曲线,将Simmons方程扩展到有限的温度和非矩形势垒。两带模型是通过混合密度泛函理论计算进行校准而参数化的第一原理,并通过带展开技术扩展到随机合金。我们的准分析模型显示出与弹道量子传输计算的定量一致性。在弹道电流的基础上,我们结合了在耦合频带的结点处产生的高阶过程,特别是界面陷阱辅助隧穿和俄歇生成过程。我们的结果表明,这两种工艺都会显着影响TFET-Auger的截止状态特性,特别是即使对于完美的接口也是如此。我们表明,我们的微观模型可用于量化TFET性能对原子界面质量的影响。最后,我们使用仿真来量化电路级指标,例如能耗。由AIP Publishing发布。

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