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首页> 外文期刊>Journal of Applied Physics >Vacancy-fluorine complexes and their impact on the properties of metal-oxide transistors with high-k gate dielectrics studied using monoenergetic positron beams
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Vacancy-fluorine complexes and their impact on the properties of metal-oxide transistors with high-k gate dielectrics studied using monoenergetic positron beams

机译:用单能正电子束研究空位-氟配合物及其对具有高k栅极电介质的金属氧化物晶体管的性能的影响

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Vacancy-fluorine complexes in metal-oxide semiconductors (MOS) with high-k gate dielectrics were studied using a positron annihilation technique. F~+ ions were implanted into Si substrates before the deposition of gate dielectrics (HfSiON). The shift of threshold voltage (V_(th)) in MOS capacitors and an increase in Fermi level position below the HfSiON/Si interface were observed after F~+ implantation. Doppler broadening spectra of the annihilation radiation and positron lifetimes were measured before and after HfSiON fabrication processes. From a comparison between Doppler broadening spectra and those obtained by first-principles calculation, the major defect species in Si substrates after annealing treatment (1050℃, 5 s) was identified as vacancy-fluorine complexes (V_3F_2). The origin of the Vth shift in the MOS capacitors was attributed to V_3F_2 located in channel regions.
机译:使用正电子an没技术研究了具有高k栅极电介质的金属氧化物半导体(MOS)中的空位氟络合物。在沉积栅极电介质(HfSiON)之前,将F〜+离子注入到Si衬底中。 F〜+注入后,观察到MOS电容器中的阈值电压(V_(th))的移动和HfSiON / Si界面下方的费米能级位置的增加。在HfSiON制备工艺前后,测量了the没辐射的多普勒展宽谱和正电子寿命。通过多普勒展宽光谱与第一性原理计算的比较,退火处理(1050℃,5 s)后Si衬底中的主要缺陷种类被确定为空位氟络合物(V_3F_2)。 MOS电容器中Vth偏移的起因归因于位于沟道区中的V_3F_2。

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