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首页> 外文期刊>Journal of Applied Physics >Experimental and theoretical investigation of the effects of sample size on copper plasma immersion ion implantation into polyethylene
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Experimental and theoretical investigation of the effects of sample size on copper plasma immersion ion implantation into polyethylene

机译:样品大小对铜等离子体浸没离子注入聚乙烯的影响的实验和理论研究

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摘要

Polymers are frequently surface modified to achieve special surface characteristics such as antibacterial properties, wear resistance, antioxidation, and good appearance. The application of metal plasma immersion ion implantation (PIII) to polymers is of practical interest as PIII offers advantages such as low costs, small instrument footprint, large area, and conformal processing capability. However, the insulating nature of most polymers usually leads to nonuniform plasma implantation and the surface properties can be adversely impacted. Copper is an antibacterial element and our previous experiments have shown that proper introduction of Cu by plasma implantation can significantly enhance the long-term antibacterial properties of polymers. However, lateral variations in the implant fluence and implantation depth across the insulating substrate can lead to inconsistent and irreproducible antibacterial effects. In this work, the influence of the sample size on the chemical and physical properties of copper plasma-implanted polyethylene is studied experimentally and theoretically using Poisson's equation and plasma sheath theory. Our results indicate that the sample size affects the implant depth profiles. For a large sample, more deposition occurs in the center region, whereas the implantation to deposition ratio shows less variation across the smaller sample. However, the Cu elemental chemical state is not affected by this variation. Our theoretical study discloses that nonuniform metal implantation mainly results from the laterally different surface potential on the insulating materials due to surface charge buildup and more effective charge transfer near the edge of the sample.
机译:经常对聚合物进行表面改性,以获得特殊的表面特性,例如抗菌性能,耐磨性,抗氧化性和良好的外观。金属等离子体浸没离子注入(PIII)在聚合物上的应用具有实际意义,因为PIII具有成本低,仪器占地面积小,面积大和保形处理能力强等优点。但是,大多数聚合物的绝缘性质通常会导致等离子体注入不均匀,并且表面性能会受到不利影响。铜是一种抗菌元素,我们以前的实验表明,通过等离子体注入适当引入铜可以显着增强聚合物的长期抗菌性能。然而,整个绝缘衬底上的注入通量和注入深度的横向变化会导致不一致和不可再现的抗菌作用。在这项工作中,使用泊松方程和等离子体鞘理论,从理论和实验上研究了样品大小对铜等离子注入聚乙烯的化学和物理性能的影响。我们的结果表明样品的大小会影响植入物的深度。对于大样品,更多的沉积发生在中心区域,而注入与沉积的比率在较小的样品上显示出较小的变化。但是,Cu元素的化学状态不受此变化的影响。我们的理论研究表明,不均匀的金属注入主要是由于表面电荷的积累和样品边缘附近更有效的电荷转移而导致的绝缘材料横向不同的表面电势所致。

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