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Thermal diffusivity study in supported epitaxial InN thin films by the traveling-wave technique

机译:行波技术研究负载型外延InN薄膜的热扩散系数

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High-quality crystalline (c) InN thin films have been obtained via gas-source molecular beam epitaxy, using hydrazoic acid (HN_3) precursor, on indium tin oxide/glass, c-sapphire, and c-GaN substrates at growth temperatures between 623 and 823 K. A systematic study of thermal diffusivity has been performed using the traveling-wave method. We report a high thermal diffusivity value of 0.55 cm~2/s for a combined 1.7 μm thick InN film grown on GaN substrates not observed before. X-ray diffraction data of InN grown on GaN substrates indicated lattice shrinkage with increasing thickness of the film that supports efficient phonon propagation and resulting higher thermal diffusivity. The latticcyibrational modes expressed in the Raman spectroscopic data corroborate the diffraction results. The thickness dependence of the thermal diffusivity has been modeled to estimate a bulk value of the essential thermal property.
机译:使用肼(HN_3)前驱体,通过气源分子束外延,在铟锡氧化物/玻璃,c蓝宝石和c-GaN衬底上,在623的生长温度下,获得了高质量的(c)InN薄膜晶体和823K。已经使用行波方法进行了热扩散率的系统研究。对于以前未观察到的在GaN衬底上生长的1.7μm厚InN薄膜,我们报告了0.55 cm〜2 / s的高热扩散率。在GaN衬底上生长的InN的X射线衍射数据表明,随着膜厚度的增加,晶格收缩,从而支持有效的声子传播并导致更高的热扩散率。拉曼光谱数据中表达的晶格模式证实了衍射结果。已经对热扩散率的厚度依赖性进行了建模,以估算基本热性能的整体值。

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