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High-temperature strength and dislocation mobility in the wide band-gap ZnO: Comparison with various semiconductors

机译:宽带隙ZnO中的高温强度和位错迁移率:与各种半导体的比较

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摘要

The mechanical strength of bulk single crystal wurtzite ZnO was investigated at elevated temperatures by means of compressive deformation. The yield stress of ZnO in the temperature range of 650-850 ℃ was found to be around 10-20 MPa, i.e., extremely lower than that of GaN, a typical wide band-gap semiconductor. On the basis of the observed temperature dependence of yield stress, the activation energy for dislocation motion at elevated temperatures in ZnO is deduced to be 0.7-1.2 eV, which follows the relation of activation energy for dislocation motion versus band-gap energy known in a variety of semiconductors.
机译:在高温下通过压缩变形研究了块状单晶纤锌矿型ZnO的机械强度。发现在650-850℃的温度范围内ZnO的屈服应力约为10-20MPa,即,比典型的宽带隙半导体GaN的屈服应力低得多。根据观察到的屈服应力的温度依赖性,可以推断出ZnO中高温下位错运动的活化能为0.7-1.2 eV,这遵循了位错运动中活化能与带隙能之间的关系。各种半导体。

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