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Oxygen precipitation heterogeneously nucleating on silicon phosphide precipitates in heavily phosphorus-doped Czochralski silicon

机译:氧沉淀在磷掺杂的切克劳斯基硅中在磷化硅上非均相成核

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摘要

Through comparison between the oxygen precipitation (OP) behaviors in heavily and lightly phosphorus (P)-doped Czochralski silicon (CZ-Si) crystals subjected to low-high two-step anneal of 600, 650, or 750 ℃/8 h+1050 ℃/16 h, we have found that in heavily P-doped CZ-Si, OP is much stronger in the-case with the nucleation anneal at 600 or 650 ℃ while it is to some extent suppressed in the case with the nucleation anneal at 750 ℃ in contrast to lightly doped CZ-Si where nucleation is enhanced at 750 ℃. Transmission electron microscopy investigation reveals that silicon phosphide precipitates of face-centered-cubic SiP form during the nucleation anneal at temperatures 650 ℃ and below. The SiP precipitates act as the heterogeneous nuclei for OP during the subsequent high temperature anneal while the oxygen precipitate nuclei containing certain amounts of P atoms generate during the nucleation anneal at 750 ℃. They are further coarsened to be larger oxygen precipitates during the subsequent high temperature anneal. Of significance is that the oxygen precipitate nucleation mechanism operating at certain temperatures for heavily P-doped CZ-Si is found to be completely different from that of lightly P-doped CZ-Si. We believe that the present work provides a further insight into OP in CZ-Si.
机译:通过比较轻度和低浓度两步退火分别为600、650或750℃/ 8 h + 1050的重掺杂和轻掺杂磷(P)的切克劳斯基硅(CZ-Si)晶体中的氧沉淀(OP)行为℃/ 16 h,我们发现在重掺杂P的CZ-Si中,在600或650℃进行成核退火的情况下,OP的强度要强得多,而在600或650℃进行成核退火的情况下,OP会被抑制。 750℃与轻掺杂CZ-Si相反,后者在750℃时成核作用增强。透射电子显微镜研究表明,在650℃及以下的温度下,成核退火过程中,面心立方SiP形成了磷化硅沉淀。在随后的高温退火过程中,SiP沉淀物充当OP的异质核,而在750℃的成核退火过程中,生成包含一定数量P原子的氧沉淀物核。它们被进一步粗化为在随后的高温退火期间更大的氧沉淀。重要的是,对于重度P掺杂的CZ-Si,在某些温度下工作的氧沉淀成核机理与轻度P掺杂的CZ-Si完全不同。我们相信,目前的工作为CZ-Si中的OP提供了进一步的见解。

著录项

  • 来源
    《Journal of Applied Physics》 |2009年第9期|228-232|共5页
  • 作者单位

    State Key Laboratory of Silicon Materials and Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, People's Republic of China;

    State Key Laboratory of Silicon Materials and Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, People's Republic of China;

    State Key Laboratory of Silicon Materials and Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, People's Republic of China Ningbo QL Electronics Co., Ltd., Gangdong Road, Ningbo Free Trade Zone, Ningbo 315800, People's Republic of China;

    State Key Laboratory of Silicon Materials and Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, People's Republic of China;

    Ningbo QL Electronics Co., Ltd., Gangdong Road, Ningbo Free Trade Zone, Ningbo 315800, People's Republic of China;

    State Key Laboratory of Silicon Materials and Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, People's Republic of China;

    State Key Laboratory of Silicon Materials and Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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