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首页> 外文期刊>Journal of Applied Physics >Band-bending effects on scanning tunneling microscope images of subsurface dopants: First-principles calculations
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Band-bending effects on scanning tunneling microscope images of subsurface dopants: First-principles calculations

机译:地下掺杂物的扫描隧道显微镜图像上的能带弯曲效应:第一性原理计算

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摘要

Tip-induced band-bending (TIBB) effects on scanning tunneling microscope (STM) images have been investigated. The TIBB has an extremal value where the surface space charge layer turns from the inversion region to the depletion one with increasing dopant concentration at a fixed sample bias. Unignorable TIBB remains even for the usual degenerate semiconductor with a dopant concentration such as 10~(18) cm~(-3) for Si. The STM images for H-terminated Si(111) surfaces with dopants substituted at the subsurface have been simulated using first-principles calculations within the density functional theory. The subsurface dopants on the STM images become distinguishable more obviously in consideration of the TIBB effect, specifically for acceptors in the occupied state images and for donors in the empty state. As a result, the TIBB effect improves agreement between the experimental and the theoretical sample biases at which the dopant's feature can be observed clearly.
机译:已经研究了尖端引起的带弯曲(TIBB)对扫描隧道显微镜(STM)图像的影响。 TIBB具有极值,其中在固定的样品偏置下,随着掺杂剂浓度的增加,表面空间电荷层从反转区域变为耗尽层。即使对于掺杂浓度为Si的10〜(18)cm〜(-3)的普通简并半导体,TIBB仍然保持着不可忽视的地位。使用密度泛函理论中的第一性原理计算,模拟了H端Si(111)表面的STM图像,该表面在次表面处被掺杂剂取代。考虑到TIBB效应,STM图像上的次表面掺杂剂变得更加明显,特别是对于处于占据状态的图像中的受体和处于空状态的施主而言。结果,TIBB效应改善了实验偏差与理论样品偏差之间的一致性,在该偏差下可以清楚地观察到掺杂物的特征。

著录项

  • 来源
    《Journal of Applied Physics》 |2009年第8期|612-615|共4页
  • 作者单位

    Department of Electronic-Engineering, The University of Electro-Communications (UEC-Tokyo), 1-5-1 Chofugaoka, Chofu, Tokyo 182-8585, Japan;

    Department of Electronic-Engineering, The University of Electro-Communications (UEC-Tokyo), 1-5-1 Chofugaoka, Chofu, Tokyo 182-8585, Japan The Institute for Solid State Physics, The University of Tokyo, Kashiwa-no-ha, Kashiwa, Chiba 277-8581, Japan;

    Department of Electronic-Engineering, The University of Electro-Communications (UEC-Tokyo), 1-5-1 Chofugaoka, Chofu, Tokyo 182-8585, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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