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首页> 外文期刊>Journal of Applied Physics >Ion-energy Distributions At A Substrate In Reactive Magnetron Sputtering Discharges In Ar/h_2s From Copper, Indium, And Tungsten Targets
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Ion-energy Distributions At A Substrate In Reactive Magnetron Sputtering Discharges In Ar/h_2s From Copper, Indium, And Tungsten Targets

机译:磁控溅射从铜,铟和钨靶中溅射出Ar / h_2s时基体上的离子能量分布

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摘要

Ion-energy distributions from copper, indium, and tungsten targets were measured during reactive sputtering in argon-hydrogen sulfide (H_2S) mixtures, since reactive magnetron sputtering of sulfides from metallic targets is of increasing interest, especially for photovoltaic applications (buffer and absorber layers, i.e., CuInS_2, In_2S_3, or WS_2). The mass spectra of the ions show a wide range of molecules H_xS_n derived from H_2S by plasma-assisted attachment both for positive (n≤9) and for negative (n ≤ 6) ions. From the copper and the indium targets metallic ions (Cu~+, In~+) could be detected. While tungsten and indium sulfur compounds were found, copper does not form compounds with sulfur, caused by its lower chemical reactivity. Positive (Ar~+, S~+, W~+, Cu~+, In~+, etc.) as well as negative ions (S~-, InS~-, WS_3~-) were measured for dc and rf (27 MHz) plasma excitations. The positive ions originate mainly from the plasma in front of the substrate and exhibit energies of about 12 eV for the dc and 18 eV for the rf discharge for the substrate at floating potential. The energy difference is caused by the higher electron temperature in the rf compared to the dc discharge. The ion-energy distributions of negative ions exhibit two distinct peaks. The high-energetic peak can be attributed to ions accelerated in the cathode dark space to a high energy (up to more than 400 eV) corresponding to the cathode (target) voltage. The second peak has its maximum at zero energy decreasing steeply up to energies of about 100 eV. These ions are generated by charge-exchange collisions of energetic species from the target (reflected neutral argon, negative sulfur ions, etc.) on their passage from the target to the substrate caused by the high charge-exchange cross section, rf magnetron sputtering leads to significantly lower energies of negative ions from the target, caused by the lower discharge voltages, which could be advantageous for the deposition of active semiconducting sulfide films.
机译:在氩气-硫化氢(H_2S)混合物中的反应溅射过程中,测量了铜,铟和钨靶的离子能分布,这是因为金属靶的硫化物的反应磁控溅射越来越受到关注,特别是对于光伏应用(缓冲层和吸收层) ,即CuInS_2,In_2S_3或WS_2)。离子的质谱图显示,对于正离子(n≤9)和负离子(n≤6),通过等离子体辅助吸附从H_2S衍生出的分子H_xS_n范围很广。从铜和铟靶中可以检测到金属离子(Cu〜+,In〜+)。尽管发现了钨和铟硫的化合物,但铜由于其较低的化学反应性而不会与硫形成化合物。测量了dc和rf的正离子(Ar〜+,S〜+,W〜+,Cu〜+,In〜+等)以及负离子(S〜-,InS〜-,WS_3〜-)。 27 MHz)等离子激发。正离子主要来自基板前面的等离子体,并且在浮置电位下,对于直流而言,其直流能量约为12 eV,对于射频放电而言,其能量约为18 eV。与直流放电相比,能量差异是由射频中较高的电子温度引起的。负离子的离子能量分布具有两个不同的峰。高能峰可归因于在阴极暗室中加速产生的离子,该离子对应于阴极(目标)电压的高能量(高达400 eV以上)。第二个峰值在零能量处具有最大值,陡然下降,直至约100 eV的能量。这些离子是由于高电荷交换横截面,射频磁控溅射引线引起的高能物质从靶材到靶材上的高能物质(反射的中性氩,负硫离子等)发生电荷交换碰撞而产生的,由于较低的放电电压,可显着降低来自靶标的负离子能量,这对于沉积活性半导体硫化物膜可能是有利的。

著录项

  • 来源
    《Journal of Applied Physics》 |2009年第5期|104-111|共8页
  • 作者单位

    Dept. Solare Energetik, Helmholtz-Zentrum Berlin fuer Materialien und Energie, Glienicker Str. 100, D-14109 Berlin, Germany;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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