Kinetics and magnitude of the reversible stress evolution during polycrystalline film growth interruptions

摘要

During the deposition of polycrystalline thin films, often intrinsic compressive stresses develop, which reversibly change in tensile direction once the deposition process is interrupted. Up to date, the underlying mechanism of such reversible stress changes during growth interruptions have been controversially discussed, mainly because the correlations between the growth conditions, the developing film microstructure and the reversible stress change were still largely unclear. The present study has experimentally established the separate effects of the pre-interruption deposition rate and the average lateral film grain size on both the magnitude and the kinetics of the reversible tensile stress rise during polycrystalline film growth interruption. To this end, real-time in situ substrate-curvature measurements were performed during polycrystalline Ag growth and upon subsequent growth interruptions for well-defined and controlled adjusted microstructures. It is shown that the magnitude of the reversible tensile stress rise during growth interruption is predominantly governed by the grain-boundary density, while the rate of the tensile stress rise during growth interruption increases with increasing pre-interruption deposition rate and increasing (lateral) Ag grain size. These phenomena can be rationalized by taking deposition-rate and lateral-grain-size dependent surface morphological developments into account.