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Voltage-controlled magnetization switching in MRAMs in conjunction with spin-transfer torque and applied magnetic field

机译:MRAM中的电压控制磁化切换,结合自旋转移扭矩和施加的磁场

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摘要

Voltage-controlled magnetic anisotropy (VCMA) effect has attracted a significant amount of attention in recent years because of its low cell power consumption during the anisotropy modulation of a thin ferromagnetic film. However, the applied voltage or electric field alone is not enough to completely and reliably reverse the magnetization of the free layer of a magnetic random access memory (MRAM) cell from anti-parallel to parallel configuration or vice versa. An additional symmetry-breaking mechanism needs to be employed to ensure the deterministic writing process. Combinations of voltage-controlled magnetic anisotropy together with spin-transfer torque (STT) and with an applied magnetic field (H_(app)) were evaluated for switching reliability, time taken to switch with low error rate, and energy consumption during the switching process. In order to get a low write error rate in the MRAM cell with VCMA switching mechanism, a spin-transfer torque current or an applied magnetic field comparable to the critical current and field of the free layer is necessary. In the hybrid processes, the VCMA effect lowers the duration during which the higher power hungry secondary mechanism is in place. Therefore, the total energy consumed during the hybrid writing processes, VCMA + STT or VCMA +H_(app), is less than the energy consumed during pure spin-transfer torque or applied magnetic field switching.
机译:近年来,由于压控磁各向异性(VCMA)效应在薄铁磁薄膜的各向异性调制过程中具有较低的单元功耗,因此引起了极大的关注。然而,仅施加的电压或电场不足以完全和可靠地将磁随机存取存储器(MRAM)单元的自由层的磁化强度从反平行配置转换为平行配置,反之亦然。需要采用其他对称中断机制来确保确定性的编写过程。评估了压控磁各向异性与自旋传递转矩(STT)和外加磁场(H_(app))的组合的开关可靠性,开关时间(错误率低)以及开关过程中的能耗。为了在具有VCMA切换机制的MRAM单元中获得较低的写入错误率,必须有与自由层的临界电流和电场相当的自旋转移转矩电流或施加的磁场。在混合过程中,VCMA效果会缩短持续较高功率的辅助机制的持续时间。因此,在混合写入过程中消耗的总能量VCMA + STT或VCMA + H_(app)小于在纯自旋传递扭矩或施加的磁场切换过程中消耗的能量。

著录项

  • 来源
    《Journal of Applied Physics》 |2016年第20期|203902.1-203902.8|共8页
  • 作者单位

    Emerging Memory Technology Development, Micron Technology, Inc., Boise, Idaho 83707, USA;

    Emerging Memory Technology Development, Micron Technology, Inc., Boise, Idaho 83707, USA;

    Emerging Memory Technology Development, Micron Technology, Inc., Boise, Idaho 83707, USA;

    Emerging Memory Technology Development, Micron Technology, Inc., Boise, Idaho 83707, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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