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机译:柔性基板上弯曲的集成电路芯片的实验和理论分析
Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing, China,Center for Nano and Micro Mechanics, Tsinghua University, Beijing, China;
School of Mechanics and Engineering, Southwest Jiaotong University, Chengdu, China;
Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing, China;
Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, United States;
Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing, China;
机译:弯曲对柔性基板上构图的指状微电极电容影响的理论和实验研究
机译:弯曲对柔性基板上构图的指状微电极电容影响的理论和实验研究
机译:集成微波和毫米波电路宽带应用的信道化共面波导(CCPW)的理论和实验分析
机译:弯曲-槽形和简单唇形槽形冷弯型钢的理论和实验分析
机译:用于柔性电子应用的柔性基板上薄膜的高循环弯曲疲劳的实验和分析研究。
机译:带有弹性微流体的固态集成电路芯片的软包装
机译:具有弹性体微流体的固态集成电路芯片的灵活包装
机译:提升转子随机载荷和振动的理论和实验研究概念。 6-a叶片扭转,叶片弯曲弯曲灵活性和转子支撑灵活性对转子稳定性和随机响应的影响