Thermomechanical Analysis of Film-on-Substrate System With Temperature-Dependent Properties

摘要

Thermomechanical analysis of global and local buckling is presented to show tempera-nture effects on the stress/strain and shape of a film-on-substrate system. First, the strainnis expressed as a function of three key temperatures (room, working, and deposit tem-nperatures). Through sensitivity analysis on temperature, polydimethylsiloxane (PDMS)nselection is determined to theoretically design film-on-substrate systems with the mini-nmum variation in stress caused by temperatures. Then, the wrinkling behaviors are stud-nied to establish the relationships of critical strain, wavelength, and amplitude with tem-nperature. In addition, the critical working temperature is determined for local buckling.nThe approximate semi-analytical solution and the finite element simulation are comparednby the use of a two-dimensional case of film on a half-space substrate.