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首页> 外文期刊>Journal of Applied Electrochemistry >Passivity and passivity breakdown of 304 stainless steel in alkaline sodium sulphate solutions
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Passivity and passivity breakdown of 304 stainless steel in alkaline sodium sulphate solutions

机译:碱性硫酸钠溶液中304不锈钢的钝化和钝化击穿

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The passivity and passivity breakdown of 304 stainless steel were investigated in 0.25 M Na2SO4solutions of pH 10. The effect of applied potential and the presence of Cl− ions in the electrolyte were also studied. Different electrochemical methods such as open circuit potential measurements, polarization techniques and electrochemical impedance spectroscopy (EIS) were used. The results showed that the steel electrode passivates under open circuit conditions and also under potentiostatic control. The rate of passive film thickening under open circuit conditions follows a simple logarithmic law. Addition of Cl− ion shifts the polarization curves in the active direction and above a critical chloride concentration, [Cl− ] ≥ 0.15 M, pitting corrosion occurs and the pitting potential, E pit, decreases linearly with the logarithm of [Cl−]. The addition of sulphate ions to the chloride-containing solutions was found to inhibit the pitting process, and at [SO2- 4] ≥ 0.25 M, a complete immunity to pitting corrosion was recorded. The impedance measurements provided support for film thickening and film breakdown reactions. An equivalent circuit model which consists of a pure resistor, R Ω, in series with a parallel combination of a pure resistor, R p, and a constant phase element, Q, was proposed to describe the electrode/electrolyte interface. The passive film thickness was found to increase with applied potential up to a critical value of 0.3 V. At higher voltages, breakdown of the passive film occured.
机译:在pH 10的0.25 M Na2 SO4 溶液中研究了304不锈钢的钝化和钝化击穿。在电解液中还施加了施加电势和Cl-离子研究。使用了不同的电化学方法,例如开路电势测量,极化技术和电化学阻抗谱(EIS)。结果表明,钢电极在开路条件和恒电位控制下均会钝化。开路条件下无源膜的增厚速率遵循简单的对数律。 Cl-离子的添加​​使极化曲线沿活动方向移动,并超过临界氯化物浓度[Cl-]≥0.15 M,发生点蚀,并且点蚀电位E pit 随[Cl-]的对数线性减小。发现将硫酸根离子添加到含氯化物的溶液中可以抑制点蚀过程,并且在[SO2- 4 ]≥0.25 M时,记录了对点蚀的完全免疫力。阻抗测量为膜增厚和膜击穿反应提供了支持。提出了一个等效电路模型,该模型由一个纯电阻器RΩ与一个串联的纯电阻器R p 和一个恒定相元素Q的并联组合组成,用于描述电极/电解质界面。发现无源膜厚度随施加的电势而增加,直至达到0.3 V的临界值。在更高的电压下,无源膜发生击穿。

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