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首页> 外文期刊>Journal of Applied Electrochemistry >Response surface analysis to evaluate the influence of deposition parameters on the electrodeposition of Cu–Co alloys in citrate medium
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Response surface analysis to evaluate the influence of deposition parameters on the electrodeposition of Cu–Co alloys in citrate medium

机译:响应面分析,评估沉积参数对柠檬酸介质中铜钴合金电沉积的影响

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Copper–cobalt alloy coatings were deposited on mild steel substrates using sodium citrate electrolytes at room temperature and under direct current. A set of cathodic polarization curves was plotted by varying the mechanical stirring speed of the solution (0–400 rpm), using a range of current densities during the electrodeposition experiments. Factorial design was used to verify the influence of these deposition parameters on the cathodic efficiency, the copper and cobalt content in the coating, the corrosion current density of the coating/substrate system, and the efficiency of the coating in protecting the substrate. The electroplating experiments showed that, with the studied bath composition, high stirring speed and low current density lead to greater cathodic current efficiency and copper-rich coatings. On the other hand, high current density and low stirring speed yields coatings with high cobalt content and a lower cathodic efficiency. Our results show that the studied parameters affect the corrosion current density and the coating efficiency of the coating/substrate system in opposite ways. The best results were obtained increasing the current density and decreasing the mechanical stirring speed. Additionally, three samples were produced in selected deposition conditions. The coatings morphologies were compact, and their grain sizes seemed to enlarge with increasing stirring speed and decreasing current density.
机译:在室温和直流电下,使用柠檬酸钠电解质将铜钴合金涂层沉积在低碳钢基底上。通过改变溶液的机械搅拌速度(0-400 rpm),在电沉积实验中使用一系列电流密度,绘制了一组阴极极化曲线。析因设计用于验证这些沉积参数对阴极效率,涂层中铜和钴含量,涂层/基材体系的腐蚀电流密度以及涂层在保护基材中的效率的影响。电镀实验表明,采用所研究的镀液组成,高搅拌速度和低电流密度可导致更大的阴极电流效率和富铜涂层。另一方面,高电流密度和低搅拌速度产生具有高钴含量和较低阴极效率的涂层。我们的结果表明,所研究的参数以相反的方式影响涂层/基材体系的腐蚀电流密度和涂层效率。获得最好的结果是增加电流密度并降低机械搅拌速度。另外,在选定的沉积条件下生产了三个样品。涂层的形貌致密,并且随着搅拌速度的增加和电流密度的减小,它们的晶粒尺寸似乎增大。

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