Copper plating on titanium alloy 6-2-4-2 using an in situ high voltage pulse followed by plate-up

摘要

We have used an in situ technique that removes the oxide from the surface of the alloy titanium 6-2-4-2, followed by copper electroplating of the surface. The oxide removal is accomplished by means of a short voltage pulse from a discharging capacitor between the cathode (titanium) and anode while submerged in the plating solution. Within seconds thereafter, the electrodes are switched to a separate power supply for electroplating copper onto the titanium. From the experimental data, we believe that the oxide is removed by means of dielectric breakdown mechanisms giving rise to a statistical probability that all of the surface oxide is removed. When this occurs, we obtain adherent depositions based on standard tape testing of the deposit. We determine a set of voltage and energy density conditions which are most likely to result in good adhesion. Scanning electron micrographs of adherent copper deposits are presented.