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Facile C−H Bond Cleavage via a Proton-Coupled Electron Transfer Involving a C−H···CuII Interaction

机译:通过质子耦合电子转移涉及CH-···CuII相互作用的CH键容易裂解。

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摘要

The present study provides mechanistic details of a mild aromatic C−H activation effected by a copper(II) center ligated in a triazamacrocylic ligand, affording equimolar amounts of a CuIII-aryl species and CuI species as reaction products. At low temperatures the CuII complex 1 forms a three-center, three-electron C−H···CuII interaction, identified by pulse electron paramagnetic resonance spectroscopy and supported by density functional theory calculations. C−H bond cleavage is coupled with copper oxidation, as a CuIII-aryl product 2 is formed. This reaction proceeds to completion at 273 K within minutes through either a copper disproportionation reaction or, alternatively, even faster with 1 equiv of 2,2,6,6-tetramethylpiperidine-1-oxyl (TEMPO), quantitatively yielding 2. Kinetic studies of both reactions strongly implicate a rate-limiting proton-coupled electron transfer as the key C−H activation step, a mechanism that does not conform to the C−H activation mechanism in a NiII analogue or to any previously proposed C−H activation mechanisms.
机译:本研究提供了通过与三氮杂环配体连接的铜(II)中心影响轻度芳烃CH活化的机理细节,提供了等摩尔量的Cu III -芳基和Cu 我种作为反应产物。在低温下,Cu II 配合物1形成三中心三电子CH-···Cu II 相互作用,通过脉冲电子顺磁共振波谱鉴定并得到支持通过密度泛函理论计算。当形成Cu III -芳基产物2时,CH键断裂与铜的氧化结合。通过铜歧化反应,该反应在几分钟内在273 K处完成,或者用1当量的2,2,6,6-四甲基哌啶-1-氧基(TEMPO)甚至更快,定量生成2。这两个反应都强烈暗示了限速质子耦合电子的转移是关键的CH活化步骤,该机理与Ni II 类似物或任何先前提出的CH激活机制。

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  • 来源
    《Journal of the American Chemical Society》 |2010年第35期|p.12299-12306|共8页
  • 作者单位

    Departament de Química and Institut de Química Computacional, Universitat de Girona, Campus de Montilivi, E-17071 Girona, Catalonia, Spain, Laboratory of Physical Chemistry, Swiss Federal Institute of Technology, ETH Hönggerberg, CH-8093 Zürich, Switz;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);美国《化学文摘》(CA);
  • 原文格式 PDF
  • 正文语种 eng
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