Semiconductor heat-transfer involves treating high conductivity metal substrate by electrolytic oxidation to provide oxidized insulation layer, covering metal conducting layer, and installing electronic device and bonding lead wires

摘要

Semiconductor heat-transfer comprises treating a high conductivity metal substrate by electrolytic oxidation to cover an oxidized insulation layer on the substrate, covering a metal conducting layer at selected locations, and installing an electronic device in the substrate and bonding lead wires. The electrolytic oxidation involves degreasing, primary chemical surface grinding, primary rinsing, neutralization process, electrolytic oxidation, secondary rinsing, sealing, hot water dipping, surface hardening, secondary chemical surface grinding, third rinsing, and drying.