Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic

摘要

The present work includes a process for encapsulation by combining substantially simultaneously dry nonmetallic printed circuit boards (PCBs) powder and recycled high-density polyethylene (rHDPE) in an extruder to form a homogenous matrix. The extruded materials were then molded into standard tensile, flexural, and impact properties testing specimens. Nonmetallic PCB mainly consists of large amount of glass fiber-reinforced epoxy resin materials. Incorporation of 50 wt% nonmetallic PCB in rHDPE matrix had increased the flexural strength and modulus by 35% and 130%, respectively. Tensile strength reported to be constant without much improvement. However, the Young's modulus has increased by 180%, with incorporation of 50 wt% nonmetallic PCB. The addition of 6 phr (parts per hundred) maleated polyethylene (MAPE) resulted in 2-fold increase in tensile and flexural strength. Regarding the leaching properties, Cu was identified as the metal that leached at the highest level from the raw nonmetallic PCB, at 59.09 mg/L. However, after the nonmetallic PCB was filled in rHDPE/PCB composites, the concentration of Cu was reduced far below the regulatory limit, to only 3 mg/L. Thermal properties of composites were studied, and it was found out that incorporation of nonmetallic PCB fillers in rHDPE resulted in low thermal conductivity, whereas mechanical strength of the composites showed maximum improvements at 220 ℃. Overall, the encapsulation technique using nonmetallic PCB waste has formed a monolithic waste form that provides a barrier to the dispersion of wastes into the environment.