A Thermal Management Strategy for Electronic Devices Based on Moisture Sorption-Desorption Processes

摘要

Currently, the thermal management of electronics has been drawing growing attention. The use of latent heat emerges as an attractive means for intermittent heat dissipation. However, traditional phase change materials (PCMs) are limited by their relatively low enthalpies. In this paper, we demonstrate a passive thermal management strategy through the desorption process of water inside sorbents. The spontaneous adsorption enables self-recovery of working capacity at rest mode. The basic guideline for selecting proper sorbents is outlined. In the proof-of-concept test, we coated MIL-101(Cr) powders onto metallic substrates. The coating of 0.288 g achieved a temperature drop (maximum 8.6°C) for 25 min at a heating power of 1.5 W. The equivalent enthalpy of the coating can be up to 1,950 J/gcoating, indicating a significant improvement compared to that of traditional PCMs. Our results suggest that this strategy could find promising applications in a variety of practical scenes.