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首页> 外文期刊>Japanese journal of applied physics >Vacancy- and interstitial-mediated self-diffusion coefficients determined from the analysis of observed self-diffusion coefficients in silicon crystals
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Vacancy- and interstitial-mediated self-diffusion coefficients determined from the analysis of observed self-diffusion coefficients in silicon crystals

机译:空缺和间隙介导的自扩散系数根据硅晶体中观察到的自扩散系数分析确定

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摘要

We clarify the mechanisms of self-diffusion mediated by both vacancies and interstitials in silicon crystals. Sudkamp and Bracht published carefully measured self-diffusion data for silicon and determined the vacancy-mediated diffusion coefficients from the difference between their new data and previous data of metal diffusion under consideration of a correlation factor. Instead, we analyzed their data using the vacancy properties: the formation energy was obtained from quenching experiments of silicon crystals in a hydrogen atmosphere, and the migration energy determined from low-temperature electron irradiation. The self-diffusion coefficient is given by the sum of the diffusion coefficients of the vacancy mechanism, 0.90 exp (-4.30 eV/k(B)T), and the interstitial mechanism, 6.9 x 10(2) exp (-4.8 eV/k(B)T) cm(2) s(-1).
机译:我们阐明了硅晶体中空位和间质介导的自扩散机制。 SUDKAMP和BRACHT发布了芯片的仔细测量自扩散数据,并确定了在考虑相关因子的新数据和先前金属扩散数据之间的差异的空位介导的扩散系数。相反,我们使用空位特性分析它们的数据:从氢气氛中的硅晶体的淬火实验获得形成能量,并且由低温电子照射测定的迁移能。自扩散系数由空位机制的扩散系数和0.90 exp(-4.30eV / k(b)t)和间隙机制,6.9 x 10(2)exp(-4.8eV / K(b)t)cm(2)s(-1)。

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