首页> 外文期刊>Japanese journal of applied physics >High mobility (>30cm~2V~(-1)s~(-1)) and low source/drain parasitic resistance In-Zn-O BEOL transistor with ultralow <10-20 A /μm~(-1) off-state leakage current
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High mobility (>30cm~2V~(-1)s~(-1)) and low source/drain parasitic resistance In-Zn-O BEOL transistor with ultralow <10-20 A /μm~(-1) off-state leakage current

机译:高迁移率(> 30cm〜2V〜(-1)s〜(-1))和低源/漏寄生电阻In-Zn-O BEOL晶体管,超低<10-20 A /μm〜(-1)截止状态漏电流

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摘要

We have demonstrated and experimentally verified the advantages of the In-Zn-O (InZnO) channel compared with the In-Ga-Zn-O (InGaZnO) channel for a high-performance oxide semiconductor channel field-effect transistor (FET) with both ultralow off-state leakage current and high on-current. Compared with the InGaZnO FET, high mobility (30 cm(2)V(-1)s(-1)) and a reduction of source/drain (S/D) parasitic resistance by 75% were achieved by the InZnO FET. Analysis of the Schottky barrier height at the S/D contact and the band offset between the oxide semiconductor channel and gate insulator SiO2 revealed that the reduction of S/D parasitic resistance originates from the lowering of the conduction band minimum by the InZnO channel. Moreover, ultralow (10(-20) A mu m(-1)) off-state leakage current characteristics including not only S/D leakage current but also gate leakage current were confirmed to be maintained even with a thin gate insulator with an equivalent oxide thickness of 6.2 nm. (C) 2019 The Japan Society of Applied Physics
机译:我们已经证明并通过实验验证了In-Zn-O(InZnO)沟道与In-Ga-Zn-O(InGaZnO)沟道相比对于高性能氧化物半导体沟道场效应晶体管(FET)的优势超低关断状态漏电流和高导通电流。与InGaZnO FET相比,InZnO FET可实现高迁移率(> 30 cm(2)V(-1)s(-1))和源/漏(S / D)寄生电阻降低75%。分析S / D接触处的肖特基势垒高度以及氧化物半导体沟道与栅绝缘体SiO2之间的带隙,发现S / D寄生电阻的减小源于InZnO沟道的导带最小值的降低。此外,即使使用具有绝缘层的栅极绝缘体薄,也可以确保不仅包括S / D泄漏电流而且包括栅极泄漏电流的超低(<10(-20)μm(-1))截止态泄漏电流特性得以保持。等效氧化物厚度为6.2 nm。 (C)2019日本应用物理学会

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  • 来源
    《Japanese journal of applied physics》 |2019年第sb期|SBBJ07.1-SBBJ07.7|共7页
  • 作者单位

    Toshiba Memory Corp, Inst Memory Technol R&D, Device Technol R&D Ctr, Kawasaki, Kanagawa 2120058, Japan;

    Toshiba Memory Corp, Inst Memory Technol R&D, Device Technol R&D Ctr, Kawasaki, Kanagawa 2120058, Japan;

    Toshiba Memory Corp, Inst Memory Technol R&D, Device Technol R&D Ctr, Kawasaki, Kanagawa 2120058, Japan;

    Toshiba Memory Corp, Inst Memory Technol R&D, Device Technol R&D Ctr, Kawasaki, Kanagawa 2120058, Japan;

    Toshiba Memory Corp, Inst Memory Technol R&D, Device Technol R&D Ctr, Kawasaki, Kanagawa 2120058, Japan;

    Toshiba Memory Corp, Inst Memory Technol R&D, Device Technol R&D Ctr, Kawasaki, Kanagawa 2120058, Japan;

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