Novel Packaging Technology for Microelectromechanical-System Devices

摘要

In this paper, we describe a novel packaging technology for use in microelectromechanical-system (MEMS) device fabrication and its application to an optical MEMS micromirror array that consists of a mirror chip and an electrode chip that controls the micromirrors. Chip-on-chip technology, which involves the selective deposition of silver paste by screen printing, is used to join the two chips. The experimental results ensure a high production yield and heat cycle test results indicate good reliability.