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首页> 外文期刊>Japanese Journal of Applied Physics. Part 2, Letters & Express Letters >Analysis of Intra-Grain Defects in Multicrystalline Silicon Wafers by Photoluminescence Mapping and Spectroscopy
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Analysis of Intra-Grain Defects in Multicrystalline Silicon Wafers by Photoluminescence Mapping and Spectroscopy

机译:用光致发光映射和光谱法分析多晶硅晶片中的晶粒内缺陷

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摘要

Highly spatial resolved photoluminescence (PL) characterization of intra-grain defects in recent multicrystalline Si wafers for solar cells was performed. Comparison of band-edge PL intensity mapping with minority carrier lifetime mapping on a whole wafer showed that low PL intensity regions correspond to short lifetime regions. PL microscopic mapping revealed that micron-sized defects are present in these regions. We also confirmed that grain boundaries are not active recombination centers. Low-temperature PL spectra were investigated, and dislocation-related lines, D1-D4, were observed only in the defect areas. We consider that these defects are ascribable to dislocations decorated with heavy metals and responsible for great degradation of lifetime.
机译:在用于太阳能电池的最新多晶硅晶片中,对晶粒内缺陷进行了高度空间分辨的光致发光(PL)表征。在整个晶片上,带边缘PL强度映射与少数载流子寿命映射的比较表明,低PL强度区域对应于短寿命区域。 PL显微镜测绘显示在这些区域中存在微米级缺陷。我们还证实,晶界不是有效的复合中心。研究了低温PL光谱,仅在缺陷区域观察到了与位错相关的线D1-D4。我们认为,这些缺陷归因于用重金属装饰的位错,并导致使用寿命大大降低。

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