首页> 外文期刊>Japanese journal of applied physics >Preparation of an Ultraclean and Atomically Controlled Hydrogen-Terminated Si(111)-(1×1) Surface Revealed by High Resolution Electron Energy Loss Spectroscopy, Atomic Force Microscopy, and Scanning Tunneling Microscopy: Aqueous NH_4F Etching Process of Si
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Preparation of an Ultraclean and Atomically Controlled Hydrogen-Terminated Si(111)-(1×1) Surface Revealed by High Resolution Electron Energy Loss Spectroscopy, Atomic Force Microscopy, and Scanning Tunneling Microscopy: Aqueous NH_4F Etching Process of Si

机译:高分辨率电子能量损失谱,原子力显微镜和扫描隧道显微镜揭示的超净原子控制的氢封端的Si(111)-(1×1)表面的制备:Si NH_4F水溶液的蚀刻工艺

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摘要

We propose an improved wet chemical process for preparing a high-quality hydrogen-terminated Si(111)-(1×1) surface and show an atomically ordered and ultraclean surface without carbon and oxygen contamination. The vibrational properties and surface morphology are investigated by high-resolution electron energy loss spectroscopy (HREELS), atomic force microscopy (AFM), and scanning tunneling microscopy (STM). The HREELS spectra and images of AFM and STM reveal the precise aqueous NH_4F etching process of Si(111) and indicate the high controllability of steps and terraces at the atomic scale. The surface cleanliness and morphology strongly depend on the etching time. At the etching time of 10 min, we obtain an ultraclean and atomically ordered surface with wide terraces of 36 ± 7 nm step distance. It is confirmed by AFM and STM that 1.0% ammonium sulfite is useful for removing dissolved oxygen in the 40% NH_4F etching solution and for preparing a high-quality H:Si(111)-(1 × 1) surface with a low density of etch pits. The onset of tunneling current and the gap of 1.39 eV are measured by scanning tunneling spectroscopy. There is no peak at —1.3 eV in comparison with the previous report [Phys. Rev. Lett. 65 (1990) 1917].
机译:我们提出了一种改进的湿化学工艺,以制备高质量的氢封端的Si(111)-(1×1)表面,并显示出原子序有序且超净的表面,而没有碳和氧的污染。通过高分辨率电子能量损失谱(HREELS),原子力显微镜(AFM)和扫描隧道显微镜(STM)研究了振动特性和表面形态。 AFM和STM的HREELS光谱和图像揭示了Si(111)的精确NH_4F水溶液蚀刻工艺,并表明在原子尺度上台阶和平台的高度可控性。表面清洁度和形态在很大程度上取决于蚀刻时间。在10分钟的蚀刻时间下,我们获得了一个超净且原子序的表面,其阶跃距离为36±7 nm。 AFM和STM证实,1.0%的亚硫酸铵可用于去除40%NH_4F蚀刻溶液中的溶解氧以及制备低密度的H:Si(111)-(1×1)高质量表面蚀坑。通过扫描隧道光谱法测量隧道电流的开始和1.39eV的间隙。与先前的报告相比,在[1.3 eV]处没有峰值。牧师65(1990)1917]。

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