Embedded Decoupling Capacitors up to 80 nF on Multichip Module-Deposited with Quasi-Three-Dimensional Metal-Insulator-Metal Structure

摘要

Embedded capacitors with available capacitances up to ～80 nF have been implemented on a thin-film multichip module-deposited (MCM-D) substrate. By cost-effective silicon wet etching, a new metal-insulator-metal (MIM) structure named quasi-three-dimensiona