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Integration ot Micro-Light-Emitting-Diode Arrays and silicon Driver for Heterogeneous Optoelectronic Integrated Circuit Device

机译:用于异构光电集成电路器件的微发光二极管阵列和硅驱动器的集成

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摘要

In this paper, we proposed the possibility of implementing a single chip device for realizing optoelectronic integrated circuits (OEICs). Micro-light-emitting-diode (LED) arrays and a complementary metal-oxide-semiconductor (CMOS) pulse width modulation (PWM) silicon driver were proposed, designed, and fabricated on a single chip. The micro-LED arrays were separated by a dry etching method into 64 pixels of 8×8, each with a size of 30×30μm~2 and operated in 3 V at 100μA The PWM Si driver was well operated and modulated using various control signals. Furthermore, to investigate the driver for handling massive parallel information, a simple multifunctional driver was designed, fabricated, and flip-chip-bonded using a gold compliant bump and anisotropic conductive adhesive with micro-LED arrays.
机译:在本文中,我们提出了实现单芯片器件以实现光电集成电路(OEIC)的可能性。提出,设计并制造了微发光二极管(LED)阵列和互补金属氧化物半导体(CMOS)脉宽调制(PWM)硅驱动器。通过干蚀刻方法将micro-LED阵列分离为64个8×8像素,每个像素尺寸为30×30μm〜2,并在3V电压下以100μA运行。PWM Si驱动器运行良好,并使用各种控制信号进行调制。此外,为了研究用于处理大量并行信息的驱动器,设计了一种简单的多功能驱动器,并使用符合金要求的凸块和各向异性导电胶与微型LED阵列进行了倒装芯片连接。

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  • 来源
    《Japanese journal of applied physics》 |2011年第4issue2期|p.04DG12.1-04DG12.4|共4页
  • 作者单位

    Department of Electrical and Information Engineering, Toyohashi University of Technology, Toyohashi, Aichi 441-8580, Japan;

    Department of Electrical and Information Engineering, Toyohashi University of Technology, Toyohashi, Aichi 441-8580, Japan;

    Department of Electrical and Information Engineering, Toyohashi University of Technology, Toyohashi, Aichi 441-8580, Japan;

    Department of Electrical and Information Engineering, Toyohashi University of Technology, Toyohashi, Aichi 441-8580, Japan;

    Stanley Electric Co., Ltd., Yokohama 225-0014, Japan;

    Department of Electrical and Information Engineering, Toyohashi University of Technology, Toyohashi, Aichi 441-8580, Japan;

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