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首页> 外文期刊>Japanese journal of applied physics >Comparison of Multilayer Dielectric Thin Films for Future Metal-lnsulator-Metal Capacitors: Al_2O_3/HfO_2/Al_2O_3 versus SiO_2/HfO_2/SiO_2
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Comparison of Multilayer Dielectric Thin Films for Future Metal-lnsulator-Metal Capacitors: Al_2O_3/HfO_2/Al_2O_3 versus SiO_2/HfO_2/SiO_2

机译:未来金属-绝缘体-金属电容器用多层介电薄膜的比较:Al_2O_3 / HfO_2 / Al_2O_3与SiO_2 / HfO_2 / SiO_2

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摘要

In this paper, two kinds of multilayered metal-insulator-metal (MIM) capacitors using Al_2O_3/HfO_2/Al_2O_3 (AHA) and SiO_2/HfO_2/SiO_2 (SHS) were fabricated and characterized for radio frequency (RF) and analog mixed signal (AMS) applications. The experimental results indicate that the AHA MIM capacitor (8.0fFrn~2) is able to provide a higher capacitance density than the SHS MIM capacitor (5.1 fFm~2), while maintaining a low leakage current of about 50 nA/cm2 at 1 V. The quadratic voltage coefficient of capacitance, α gradually decreases as a function of stress time under constant voltage stress (CVS). The parameter variation of SHS MIM capacitors is smaller than that of AHA MIM capacitors. The effects of CVS on voltage linearity and time-dependent dielectric breakdown (TDDB) characteristics were also investigated.
机译:本文制备了两种使用Al_2O_3 / HfO_2 / Al_2O_3(AHA)和SiO_2 / HfO_2 / SiO_2(SHS)的多层金属-绝缘体-金属(MIM)电容器,并对其射频(RF)和模拟混合信号( AMS)应用程序。实验结果表明,AHA MIM电容器(8.0fF / nrn〜2)能够提供比SHS MIM电容器(5.1 fF / nm〜2)更高的电容密度,同时保持大约50 nA / A的低漏电流。在1 V时为cm2。在恒定电压应力(CVS)下,电容的二次电压系数α随应力时间而逐渐减小。 SHS MIM电容器的参数变化小于AHA MIM电容器的参数变化。还研究了CVS对电压线性和随时间变化的介电击穿(TDDB)特性的影响。

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  • 来源
    《Japanese journal of applied physics》 |2011年第10issue2期|p.10PB06.1-10PB06.4|共4页
  • 作者单位

    Department of Electronics Engineering, Chungnam National University, Daejeon 305-764, Korea,Hynix Semiconductor Inc., Ichon, Gyeonggi 467-701, Korea;

    Department of Electronics Engineering, Chungnam National University, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Daejeon 305-764, Korea;

    Dongbu HiTec Semiconductor Inc., Seoul 891-10, Korea;

    Dongbu HiTec Semiconductor Inc., Seoul 891-10, Korea;

    International SEMATECH, Austin, TX 78741, U.S.A;

    Department of Materials Science and Engineering, Gwangju Institute of Science and Technology (GIST), Gwangju 500-712, Korea;

    International SEMATECH, Austin, TX 78741, U.S.A;

    Department of Electronics Engineering, Chungnam National University, Daejeon 305-764, Korea;

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