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机译:集成工艺开发,用于改进与高级Cu互连上的有机无孔超低k介电碳氟化合物的兼容性
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan;
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan;
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan,Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan;
Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan;
Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan;
Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan;
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan;
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan;
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan;
Advanced Technology R&D Center, Mitsubishi Electric Corporation, Amagasaki, Hyogo 661-8661, Japan;
Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan;
Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan;
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan;
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan,Advanced Technology R&D Center, Mitsubishi Electric Corporation, Amagasaki, Hyogo 661-8661, Japan;
机译:将新型无孔低k介电氟碳化合物集成到高级Cu互连中
机译:将新型无孔低k介电氟碳化合物集成到高级Cu互连中
机译:新型无孔低/ c介电碳氟化合物在铜互连上的电学特性,可产生22 nm及更高的电特性
机译:具有有机无孔超低介电常数碳氟化合物(k = 2.2)的新型化学,热和电稳健的Cu互连结构
机译:用于高级ULSI应用的Al(Cu)和Cu互连中的热应力和微观结构。
机译:具有溶液可加工聚合物-陶瓷纳米粒子复合电介质的低功率柔性有机场效应晶体管
机译:铜钝化,用于集成填充间隙的超低k电介质