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首页> 外文期刊>Japanese journal of applied physics >Fabrication of p-Type SnO Thin-Film Transistors by Sputtering with Practical Metal Electrodes
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Fabrication of p-Type SnO Thin-Film Transistors by Sputtering with Practical Metal Electrodes

机译:用实用金属电极溅射制备p型SnO薄膜晶体管

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摘要

P-type thin-film transistors using polycrystalline tin monoxide (SnO) active layers were achieved by an industry-compatible sputtering technique with a SnO ceramic target. The SnO films clearly exhibited p-type conduction with the p-type Hall mobilities of 1-4cm~2V~(-1)s~(-1) and hole concentrations of 10~(17)-10~(18) cm~3. The physical and chemical structures of SnO films were characterized by X-ray diffraction analysis and X-ray photoemission spectroscopy. It is concluded that amorphous and SnO-dominant films were obtained as deposited. Further annealing at≤ 300℃ induces crystallization but no major chemical reaction. The transmission line method was adopted to characterize the contact resistance between SnO layers and various metal electrodes. Results show that Mo and Ni could be used as effective electrodes for p-type SnO, avoiding the use of noble metals. Finally, p-type SnO TFTs using practical metal electrodes were fabricated, where a field-effect mobility of up to 1.8 cm~2 V~(-1) s~(-1) and an on/off current ratio of >10~3 were achieved.
机译:通过工业兼容的溅射技术和SnO陶瓷靶,可以实现使用多晶一氧化锡(SnO)有源层的P型薄膜晶体管。 SnO薄膜具有明显的p型导电性,p型霍尔迁移率为1-4cm〜2V〜(-1)s〜(-1),空穴浓度为10〜(17)-10〜(18)cm〜。 3。通过X射线衍射分析和X射线光发射光谱对SnO薄膜的物理和化学结构进行了表征。结论是,获得了非晶态和SnO主导的薄膜。在≤300℃下进一步退火会引起结晶,但没有重大化学反应。采用传输线方法表征SnO层与各种金属电极之间的接触电阻。结果表明,Mo和Ni可用作p型SnO的有效电极,避免了使用贵金属。最后,使用实际金属电极制造了p型SnO TFT,其场效应迁移率高达1.8 cm〜2 V〜(-1)s〜(-1),开/关电流比> 10〜实现了3个。

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  • 来源
    《Japanese journal of applied physics》 |2013年第5issue2期|05DC07.1-05DC07.6|共6页
  • 作者单位

    Graduate Institute of Electronics Engineering, Graduate Institute of Photonics and Optoelectronics, Department of Electrical Engineering, and Innovative Photonics Advanced Research Center (i-PARC), National Taiwan University, Taipei 10617, Taiwan;

    Graduate Institute of Electronics Engineering, Graduate Institute of Photonics and Optoelectronics, Department of Electrical Engineering, and Innovative Photonics Advanced Research Center (i-PARC), National Taiwan University, Taipei 10617, Taiwan;

    Graduate Institute of Electronics Engineering, Graduate Institute of Photonics and Optoelectronics, Department of Electrical Engineering, and Innovative Photonics Advanced Research Center (i-PARC), National Taiwan University, Taipei 10617, Taiwan;

    Graduate Institute of Electronics Engineering, Graduate Institute of Photonics and Optoelectronics, Department of Electrical Engineering, and Innovative Photonics Advanced Research Center (i-PARC), National Taiwan University, Taipei 10617, Taiwan;

    Graduate Institute of Electronics Engineering, Graduate Institute of Photonics and Optoelectronics, Department of Electrical Engineering, and Innovative Photonics Advanced Research Center (i-PARC), National Taiwan University, Taipei 10617, Taiwan;

    Graduate Institute of Electronics Engineering, Graduate Institute of Photonics and Optoelectronics, Department of Electrical Engineering, and Innovative Photonics Advanced Research Center (i-PARC), National Taiwan University, Taipei 10617, Taiwan;

    Graduate Institute of Electronics Engineering, Graduate Institute of Photonics and Optoelectronics, Department of Electrical Engineering, and Innovative Photonics Advanced Research Center (i-PARC), National Taiwan University, Taipei 10617, Taiwan;

    AU Optronics Corporation, Hsinchu Science Park, Hsinchu 300, Taiwan;

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