2 substrates by reactive DC magnet'/> Fabrication and Characterization of p-type SnO Thin-Film Transistors by Reactive DC Magnetron Sputtering
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Fabrication and Characterization of p-type SnO Thin-Film Transistors by Reactive DC Magnetron Sputtering

机译:反应型直流磁控溅射制备p型SnO薄膜晶体管及其表征

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In this study, the p-type SnO thin films were prepared on Si/SiO2 substrates by reactive DC magnetron sputtering and post-annealing treatment. We investigated the effects of annealing temperature on the electrical properties of the p-type SnO semiconductor thin films and thin-film transistors. XRD examination confirmed that these as-prepared SnO thin films were polycrystalline in nature and exhibited tetragonal SnO structure. The electrical resistivity of the annealed SnO thin films increased with raising annealing temperature because the reduction in the hole concentration. According to the transfer characteristics of the SnO TFTs, it was found that raising annealing temperature not only reduced the on current and off current but also leaded to the threshold voltage shifted towards negative voltage region. The TFT with a 200 °C annealed SnO active channel layer showed the highest on-to-off current ratio of 3.35×103, the smallest subthreshold swing of 10.0 V/dec, and a mobility of 1.65 cm2/Vs.
机译:在这项研究中,在Si / SiO上制备了p型SnO薄膜 2 通过反应性直流磁控溅射和后退火处理处理基板。我们研究了退火温度对p型SnO半导体薄膜和薄膜晶体管的电性能的影响。 XRD检查证实,这些制备的SnO薄膜本质上是多晶的,并且表现出四方SnO结构。随着退火温度的升高,退火的SnO薄膜的电阻率增加,这是因为空穴浓度的降低。根据SnO TFT的传输特性,发现提高退火温度不仅降低了导通电流和截止电流,而且导致阈值电压向负电压区域移动。具有200°C退火SnO有源沟道层的TFT的最高通断电流比为3.35×10 3 ,最小亚阈值摆幅为10.0 V / dec,迁移率为1.65 cm 2 / Vs。

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