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Study about the damaged mechanism of the patterned perpendicular magnetic tunnel junctions by hydrogen ion treatments

机译:氢离子对图案化垂直磁隧道结损伤机理的研究

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摘要

In order to study about the degradation mechanism of the patterned perpendicular magnetic tunnel junctions (MTJs) by the hydrogen plasma condition (HPC) and hydrogen etching condition (HEC) treatments, we calculated the magneto-resistance (MR) and resistance (R) trends of the patterned MTJs at several electric and magnetic conditions of the damaged layer and correlated calculated results with experimental trends by the HPC and HEC treatments. As a result of this study, it has been recognized that hydrogen by the HPC treatment just reacts with the damaged layer at the edge of patterned MTJs, while it by the HEC treatment reacts with damage-less area of the patterned MTJs as well as the damaged layer. It is because the applied bias voltage during the HEC process can accelerate the reactivity of hydrogen plasma ions to penetrate into the interface between MgO and CoFeB of the patterned MTJs. In addition, it has been also recognized that the damaged layer generated by hydrogen plasma ions makes the MR and R degradations of patterned MTJs by interference with flows of current. (C) 2015 The Japan Society of Applied Physics
机译:为了研究通过氢等离子体条件(HPC)和氢蚀刻条件(HEC)处理的图案化垂直磁隧道结(MTJs)的降解机理,我们计算了磁阻(MR)和电阻(R)趋势在受损层的几种电磁条件下图案化的MTJ的分布,并通过HPC和HEC处理将计算结果与实验趋势相关联。这项研究的结果是,已经认识到,通过HPC处理的氢只与图案化MTJ边缘的受损层反应,而通过HEC处理的氢与图案化MTJ以及无损区域反应。损坏的层。这是因为在HEC工艺期间施加的偏置电压可以加速氢等离子体离子的反应性,以渗透到图案化的MTJ的MgO和CoFeB之间的界面中。另外,还已经认识到,由氢等离子体离子产生的损坏层由于干扰电流而使得图案化的MTJ的MR和R劣化。 (C)2015年日本应用物理学会

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  • 来源
    《Japanese journal of applied physics》 |2015年第4s期|04DM07.1-04DM07.4|共4页
  • 作者

    Jeong Junho; Endoh Tetsuo;

  • 作者单位

    Samsung Elect Co Ltd, Semicond R&D Ctr, Hwasung 445701, Gyeonggi, South Korea.;

    Tohoku Univ, Ctr Innovat Integrated Elect Syst, Sendai, Miyagi 9800845, Japan.;

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