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Effects of annealing on the electrical characteristics of GaAs/GaAs junctions by surface-activated bonding

机译:退火对表面活化键合GaAs / GaAs结电学特性的影响

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摘要

The electrical properties of GaAs/GaAs junctions fabricated by surface-activated bonding (SAB) and annealing were examined on the basis of the charge neutral level model. The potential barrier height, the density of interface states, and the charge neutral level at GaAs/GaAs interfaces were estimated from the measured dependences of the electrical conductance of n-GaAs-GaAs and p-GaAs/p-GaAs junctions on ambient temperature. The barrier height and the density of interface states were lowered by increasing the annealing temperature to 400 degrees C, which suggested that the damage introduced during the SAB process was partly reduced. (C) 2016 The Japan Society of Applied Physics
机译:在电荷中性能级模型的基础上,研究了通过表面活化键合(SAB)和退火工艺制备的GaAs / GaAs结的电性能。根据测量的n-GaAs / n-GaAs和p-GaAs / p-GaAs结的电导率对周围环境的依赖性,可以估算出势垒高度,界面态密度和GaAs / GaAs界面处的电荷中性能级温度。通过将退火温度提高到400摄氏度,降低了势垒高度和界面态密度,这表明在SAB工艺中引入的损伤可以部分减少。 (C)2016年日本应用物理学会

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  • 来源
    《Japanese journal of applied physics》 |2016年第6期|068002.1-068002.3|共3页
  • 作者单位

    Osaka City Univ, Grad Sch Engn, Osaka 5588585, Japan;

    Osaka City Univ, Grad Sch Engn, Osaka 5588585, Japan;

    Osaka City Univ, Grad Sch Engn, Osaka 5588585, Japan;

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