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首页> 外文期刊>Japanese journal of applied physics >Noncontact measurement of substrate temperature by optical low-coherence interferometry in high-power pulsed magnetron sputtering
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Noncontact measurement of substrate temperature by optical low-coherence interferometry in high-power pulsed magnetron sputtering

机译:大功率脉冲磁控溅射中通过光学低相干干涉法非接触式测量衬底温度

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摘要

Substrate temperature is one of the important parameters that affect the quality of deposited films. The monitoring of the substrate temperature is an important technique of controlling the deposition process precisely. In this study, the Si substrate temperature in high-power pulse magnetron sputtering (HPPMS) was measured by a noncontact method based on optical low-coherence interferometry (LCI). The measurement was simultaneously performed using an LCI system and a thermocouple (TC) as a contact measurement method. The difference in measured value between the LCI system and the TC was about 7.4 degrees C. The reproducibilities of measurement for the LCI system and TC were +/- 0.7 and +/- 2.0 degrees C, respectively. The heat influx from the plasma to the substrate was estimated using the temporal variation of substrate temperature and increased from 19.7 to 160.0 mW/cm(2) with increasing target applied voltage. The major factor for the enhancement of the heat influx would be charged species such as ions and electrons owing to the high ionization degree of sputtered metal particles in HPPMS. (C) 2018 The Japan Society of Applied Physics
机译:基板温度是影响沉积膜质量的重要参数之一。基板温度的监视是精确控制沉积过程的重要技术。在这项研究中,通过基于光学低相干干涉法(LCI)的非接触方法测量了大功率脉冲磁控溅射(HPPMS)中的Si衬底温度。使用LCI系统和热电偶(TC)作为接触测量方法同时进行测量。 LCI系统和TC之间的测量值差异约为7.4摄氏度。LCI系统和TC的测量重现性分别为+/- 0.7和+/- 2.0摄氏度。使用基板温度的时间变化来估计从等离子体到基板的热流入,随着目标施加电压的增加,热量从19.7增加到160.0 mW / cm(2)。由于HPPMS中溅射金属粒子的高电离度,导致热量流入的主要因素是带电物质,例如离子和电子。 (C)2018日本应用物理学会

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  • 来源
    《Japanese journal of applied physics》 |2018年第1s期|01AC03.1-01AC03.5|共5页
  • 作者单位

    Meijo Univ, Fac Sci & Technol, Dept Elect & Elect Engn, Nagoya, Aichi 4688502, Japan;

    Meijo Univ, Fac Sci & Technol, Dept Elect & Elect Engn, Nagoya, Aichi 4688502, Japan;

    Chiba Inst Technol, Fac Engn, Dept Elect & Elect Engn, Narashino, Chiba 2750016, Japan;

    Gifu Univ, Fac Engn, Dept Engn Mech, Gifu 5011193, Japan;

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