机译:使用光纤型低相干干涉法同时测量SiO_2 / Si晶片上的衬底温度和薄膜厚度
Department of Opto-Mechatronics, Faculty of Systems Engineering, Wakayama University, 930 Sakaedani, Wakayama 640-8510, Japan;
R & D Division, Tokyo Electron AT Ltd., 2381-1 Kitagejo, Fujii-cho, Nirasaki 407-8511, Japan;
Department of Opto-Mechatronics, Faculty of Systems Engineering, Wakayama University, 930 Sakaedani, Wakayama 640-8510, Japan;
Department of Electrical Engineering and Computer Science, Graduate School of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8603, Japan;
Department of Opto-Mechatronics, Faculty of Systems Engineering, Wakayama University, 930 Sakaedani, Wakayama 640-8510, Japan;
机译:使用超连续光的光纤型低相干干涉法测量硅基板的温度
机译:使用低相干干涉法同时原位测量二氧化硅等离子体刻蚀过程中的硅衬底温度和二氧化硅膜厚度
机译:低相干干涉法同时测量膜厚和评估壁温
机译:色散白光干涉法同时测量薄膜厚度和折射率
机译:使用原位椭偏仪在快速热处理中测量和控制硅片温度和氧化膜厚度。
机译:用于深度分辨核形态的体内临床测量的角度分辨低相干干涉测量光纤探针的设计和验证
机译:纤维光低相干干涉法不接触化学蚀刻Si膜厚度均匀性