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Microstructures and Properties of High-strength Alloys Severely Deformed by Machining

机译:机加工严重变形的高强度合金的组织与性能

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摘要

Microstructures and properties were examined on the chip specimens severely deformed to a given shear strain (γ) by machining in the high-strength Ni-base Inconel X-750 alloy and 6061-T6 aluminum alloy. Chip specimens has a deformation structure principally composed of elongated grains (for example, a few μm to about 100 μm in length and about 1 μm to a few tens μm in width for the chip specimen of γ≈3 of the Inconel X-750 alloy). Many subgrains separated by small or medium angle grain boundaries (misorientation, θ<15°) were also observed within relatively large grains. In the case where detailed analysis by FESEM/EBSP was possible, the fraction of large angle grain boundaries (θ≥15°) and that of medium angle grain boundaries (5°≤θ<15°) were relatively small, and most of grain boundaries were small grain boundaries (1°≤θ<5°) in the chip specimens of both alloys. Internal friction of the chip specimen was much larger than that of the original material. Large internal friction of the chip specimens was principally attributed to many cracks formed during machining. The hardness of chip specimens largely increased with increasing shear strain imposed by machining in the Inconel X-750 alloy, although the increase of hardness with shear strain was not so large in the 6061-T6 alloy.
机译:通过在高强度镍基Inconel X-750合金和6061-T6铝合金中进行机加工,检查了在严重变形至给定剪切应变(γ)的切屑试样上的组织和性能。芯片试样的变形结构主要由拉长的晶粒组成(例如,对于Inconel X-750合金的γ≈3的芯片试样,长度为几微米至大约100微米,宽度大约为1微米至几十微米。 )。在相对较大的晶粒内还观察到许多由小角度晶粒或中等角度晶粒边界(取向错误,θ<15°)隔开的亚晶粒。在可以通过FESEM / EBSP进行详细分析的情况下,大角度晶界(θ≥15°)和中等角度晶界(5°≤θ<15°)的比例相对较小,且大部分晶粒两种合金的芯片试样中的晶界都是小的晶界(1°≤θ<5°)。芯片样品的内部摩擦比原始材料大得多。切屑样品的大内摩擦主要归因于加工过程中形成的许多裂纹。在Inconel X-750合金中,切削后试样的硬度会随着机械加工所施加的剪切应变的增加而大大增加,尽管在6061-T6合金中,硬度随剪切应变的增加并不那么大。

著录项

  • 来源
    《ISIJ international》 |2008年第6期|815-823|共9页
  • 作者单位

    Department of Mechanical Engineering, Faculty of Engineering and Resource Science, Akita University, 1-1 Tegatagakuen- cho, Akita 010-8502 Japan;

    Technology Department, Electronics Division, Kobelco Research Institute Inc., 1-5-5 Takatsuka-dai, Nishi-ku, Kobe 651-2271 Japan;

    Department of Mechanical Engineering, Faculty of Engineering and Resource Science, Akita University, 1-1 Tegatagakuen- cho, Akita 010-8502 Japan;

    Technology Department, Electronics Division, Kobelco Research Institute Inc., 1-5-5 Takatsuka-dai, Nishi-ku, Kobe 651-2271 Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    microstructure; FESEM/EBSP method; machining; internal friction;

    机译:微观结构FESEM / EBSP方法;加工;内部摩擦;
  • 入库时间 2022-08-18 00:04:15

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