首页> 外国专利> Method of modifying properties of high-strength, high-conductivity Cu-Ag alloy plate, and method of producing high-strength, high conductivity Cu-Ag alloy plate

Method of modifying properties of high-strength, high-conductivity Cu-Ag alloy plate, and method of producing high-strength, high conductivity Cu-Ag alloy plate

机译:改变高强度,高电导率的Cu-Ag合金板的性能的方法以及生产高强度,高电导率的Cu-Ag合金板的方法

摘要

The present invention provides a method of modifying conductivity- and strength-related properties of a Cu—Ag alloy plate produced by predetermined annealing and cold rolling, composed of 4 to 32% by atom of Ag and Cu accounting for the balance, wherein the plate rolled at any reduction ratio is heated at different temperature levels, and strength and conductivity of the plate after the annealing are measured for each annealing temperature so as to establish the conductivity-annealing temperature curve and strength-annealing temperature curve as the correlations between annealing temperature and strength and between annealing temperature and conductivity, then, an optimum annealing temperature required to provide a desired conductivity or strength is determined by extrapolating the above-described conductivity-annealing temperature curve or strength-annealing temperature curve at the desired conductivity or strength, and the plate prepared at any reduction ratio is annealed at the optimum annealing temperature.
机译:本发明提供了一种方法,该方法改变了通过预定的退火和冷轧生产的Cu-Ag合金板的电导率和强度相关的特性,该Cu-Ag合金板由4至32%原子的Ag和Cu构成,其中余量为平衡。以不同的压下率轧制的钢板在不同的温度水平下加热,并测量退火后板的强度和电导率,以建立电导率退火温度曲线和强度退火温度曲线,作为退火温度之间的相关性。在退火温度和电导率之间,然后通过在期望的电导率或强度下外推上述电导率退火温度曲线或强度退火温度曲线来确定提供期望的电导率或强度所需的最佳退火温度,以及将以任何缩小比例准备的板退火至最佳退火温度。

著录项

  • 公开/公告号US6800151B1

    专利类型

  • 公开/公告日2004-10-05

    原文格式PDF

  • 申请/专利权人 TANAKA KIKINZOKU KOGYO K.K.;

    申请/专利号US20010926758

  • 发明设计人 KUNIHIRO SHIMA;

    申请日2001-12-13

  • 分类号C23F10/80;

  • 国家 US

  • 入库时间 2022-08-21 23:16:58

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