Spreading and Solidification of Liquid Metal Droplets on a Substrate; Experiment, Analytical Model, and Numerical Simulation

摘要

The main motivation for this work was in the connection with the novel solder-drop-printing process as an alternative and addition to presently available solder bumping processes for Flip Chip application. In this process, the Liquid droplets are deposited directly on the wettable bond-pad metallization. The shape of solidified droplet produced on surface of substrates including the multilayer microchip substrates is affected by fluid dynamics and the heat transfer processes occurring at the collision of liquid droplets with solid surface.