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Research on Power Electronic Integrated Module for SMPs

机译:用于SMP的电力电子集成模块的研究

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摘要

A novel structure for a power module used in switching mode power supplies (SMPs) is presented in this paper. The power module employs the three-dimensional terrace structure resulting in lowered parasitic parameters and a higher power density. Based on this structure, the characteristics of the power module, such as parasitic parameters and thermal management performance are evaluated through simulation analysis and experimental research. The measured results for a 1kw prototype demonstrate that the power module based on an aluminum substrate has higher power density, smaller volume and better thermal performance when compared to a module using a conventional structure.
机译:本文提出了一种用于开关电源(SMP)的电源模块的新颖结构。电源模块采用三维平台结构,从而降低了寄生参数并提高了功率密度。基于此结构,通过仿真分析和实验研究来评估功率模块的特性,例如寄生参数和热管理性能。 1kw原型的测量结果表明,与使用常规结构的模块相比,基于铝基板的功率模块具有更高的功率密度,更小的体积和更好的热性能。

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