Development of Ultra-Low Fire COG and X7R Dielectric Compositions for Multilayer Ceramic Chip capacitor and integrated Passive Component Applications

摘要

A series of COG and X7R dielectric compositions have been developed which densify at temperatures below 1000deg.c. These compositions have been demonstrated to be compatible with 90:10 and 95:5 Ag:Pd internal electrode metal systems in multiplayer ceramic capacitor devices. In addition, these devices have been subjected to mechanical, electrical, and environmental reliability testing and have exhibited failure rates that meet accepted industry standard pass/fail criteria. A feasibility study in which multiple dielectric constant materials were cofired in a monolithic structure indicates that these materials are good candidates for integrated passive component applications. A multi- layer ceramic capacitor cost model shows that when these materials are used with 95:5 Ag:Pd, the total material cost independent of processing cost is lower than the material cost for Ni electrode material systems