机译:3D-IC集成微通道层间冷却中不同结构和分配对流体流动和传热性能的影响
Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 700124, China;
Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 700124, China;
Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 700124, China;
Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 700124, China;
3D-IC; Interlayer cooling; Micro-channel; Reentrant cavities; Allocations; Heat transfer;
机译:低温两相微通道散热器的流体流动和传热特性-第2部分。过冷沸腾压降和传热
机译:散热器结构对半导体和纳米流体冷却传热性能的影响
机译:超临界冷却液的传热和水力阻力。第二部分:正常和恶化传热条件下圆管加热过程中超临界压力流体的水力阻力和平均湍流结构的实验数据
机译:纳米流体流过圆形散热水槽传热性能的调查,以冷却电子产品
机译:使用微喷射和微通道液流对高热通量集成芯片进行热流模拟分析。
机译:双层复杂结构微通道散热器内流体流动和传热的数值分析
机译:双层复合结构微通道散热器流体流动和传热的数值分析
机译:用于制冷冷却应用的高热通量微通道散热器中的两相流。第1部分:用于直接制冷冷却的微通道散热器;最终的评论。 2007年4月1日至2008年9月30日