首页> 外文期刊>International Journal of Heat and Mass Transfer >Effects of different structures and allocations on fluid flow and heat transfer performance in 3D-IC integrated micro-channel interlayer cooling
【24h】

Effects of different structures and allocations on fluid flow and heat transfer performance in 3D-IC integrated micro-channel interlayer cooling

机译:3D-IC集成微通道层间冷却中不同结构和分配对流体流动和传热性能的影响

获取原文
获取原文并翻译 | 示例
       

摘要

3D-IC is getting increasingly attractive, as it improves speed and frequency and reduces power consumption, noise and latency. However, three-dimension (3D) integration technology brings a new serious challenge to chip thermal management with the power density increased exponentially. Interlayer micro-channel liquid cooling is a promising and scalable solution for high heat flux removal in 3D-IC. The effects of geometric parameters on fluid flow and heat transfer characteristics in interlayer micro-channel cooling for 3D-IC with triangular reentrant cavities (TRC) and fan-shaped reentrant cavities (FRC) are numerically investigated. 3D-IC with TRC and FRC for pitch » 0.1/0.2 mm and height» 0.2 mm are analyzed and compared with rectangular micro-channel (RMC) for 1 cm~2 heat areas. Results show that the heat rate and pressure drop distributions of each layer for length - 5 mm and pitch - 0.2 mm are more uniform. The micro-channels of pitch = 0.1 mm have better heat transfer performance, simultaneously cause the pressure drop and pumping power increasing sharply, which are undesirable and uneconomical for 3D-IC. For smaller Re, the micro-channels with surface enhancement structures TRC and FRC deteriorate heat transfer. While at the larger Re, heat transfer is enhanced, which can be attributed to heat transfer area increased, boundary layer thinned, boundary layer interrupted and chaotic advection by generating vortices. The 3D-IC with FRC-L5-P0.2 has better heat transfer performance and lowest pumping power, which is more suitable and economical for 3D-IC inter-layer cooling. For channel length of 10 mm, the fluid temperature is higher in the last 5 mm, which deteriorates heat transfer effect, simultaneously the longer length leads to pumping power and flow resistance enlarged. Besides, 3D-1C with FRC decreases the laminar stagnation zones and improves the heat transfer performance, due to owning bigger included angle of the expansion and constriction walls in channel.
机译:3D-IC不断提高吸引力,因为它提高了速度和频率,并减少了功耗,噪声和延迟。然而,随着功率密度成倍增加,三维(3D)集成技术给芯片热管理带来了新的严峻挑战。层间微通道液体冷却是3D-IC中去除高热通量的有前途且可扩展的解决方案。数值研究了几何参数对带有三角形凹腔(TRC)和扇形凹腔(FRC)的3D-IC层间微通道冷却中流体流动和传热特性的影响。分析了具有TRC和FRC的间距»0.1 / 0.2 mm和高度»0.2 mm的3D-IC,并将其与矩形微通道(RMC)在1 cm〜2的加热区域进行了比较。结果表明,长度为5 mm且节距为0.2 mm的每层的热速率和压降分布更为均匀。间距= 0.1 mm的微通道具有更好的传热性能,同时导致压降和泵浦功率急剧增加,这对于3D-IC来说是不希望的且不经济的。对于较小的Re,具有表面增强结构TRC和FRC的微通道会破坏传热。在较大的Re处,传热增强,这可归因于传热面积增加,边界层变薄,边界层中断以及通过产生涡流而导致对流混乱。带有FRC-L5-P0.2的3D-IC具有更好的传热性能和最低的泵浦功率,这对于3D-IC层间冷却更合适且更经济。对于10 mm的通道长度,最后5 mm的流体温度较高,这会降低传热效果,同时较长的通道长度会导致泵送功率和流阻增大。此外,具有FRC的3D-1C由于在通道中具有较大的扩张壁和收缩壁夹角,从而减少了层流停滞区并提高了传热性能。

著录项

  • 来源
    《International Journal of Heat and Mass Transfer》 |2015年第12期|1167-1175|共9页
  • 作者单位

    Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 700124, China;

    Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 700124, China;

    Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 700124, China;

    Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 700124, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    3D-IC; Interlayer cooling; Micro-channel; Reentrant cavities; Allocations; Heat transfer;

    机译:3D-IC;层间冷却;微信;凹腔;分配;传播热量;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号