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首页> 外文期刊>International Journal of Heat and Mass Transfer >Remarkably reduced thermal contact resistance of graphene/olefin block copolymer/paraffin form stable phase change thermal interface material
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Remarkably reduced thermal contact resistance of graphene/olefin block copolymer/paraffin form stable phase change thermal interface material

机译:石墨烯/烯烃嵌段共聚物/石蜡形成稳定相变热界面材料的显着降低

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摘要

Thermal contact resistance is a key bottleneck to restrict the rapid heat dissipation of electronic device. The wetting between two contact surfaces is one of the most important factors affecting the thermal contact resistance. Phase change thermal interface material can transform from solid state to molten state by heat inducing, which is an efficient way to reduce the thermal contact resistance. In this work, a novel form stable phase change thermal interface material of graphene/olefin block copolymer/paraffin filled with graphene (≤4.0 wt%) was designed. Furthermore, the influence of temperature and pressure on thermal contact resistance were studied, and the dominant position of thermal contact resistance and R_(TIMs) in total thermal resistance was analyzed systematically. The results exhibit that thermal contact resistance decreases sharply from 8-20 Kcm~2 /W to 0.1-0.2 Kcm~2-/W for the temperature increases from 37 °C to 45 °C (50 Psi), with a drop of up to two orders of magnitude. This is because the wettability of the two contact surfaces is greatly improved by changing solid-liquid contact to solid-liquid contact. In addition, the thermal contact resistance decreases slightly with the increase of pressure (10-50 Psi, 48 °C). A small amount of graphene can significantly enhance the thermal conductivity of graphene/olefin block copolymer/paraffin, but the effect on thermal contact resistance is relatively weak. Moreover, critical thickness is proposed to quantitatively evaluate the dominant position of thermal contact resistance or R_(TIMs) in total thermal resistance. It facilitates the quantitative analysis and optimization of thermal resistance in practical application.
机译:热接触电阻是限制电子设备快速散热的关键瓶颈。两个接触表面之间的润湿是影响热接触电阻的最重要因素之一。相变热界面材料可以通过热诱导从固态转换为熔融状态,这是降低热接触电阻的有效方法。在这项工作中,设计了一种新型的石墨烯/烯烃嵌段共聚物/石蜡的新型稳定相变热界面材料(填充石墨烯(≤4.0wt%)。此外,研究了温度和压力对热接触电阻的影响,系统系统地分析了总热阻的热接触电阻和R_(TIM)的主导位置。结果表明,对于温度从37℃至45°C(50psi)增加,热接触电阻急于从8-20kcm〜2 / w至0.1-0.2kcm〜2-/ w。到两个数量级。这是因为通过将固液接触改变为固液接触,可以大大提高两个接触表面的润湿性。此外,热接触电阻随着压力的增加而略微降低(10-50psi,48℃)。少量石墨烯可以显着提高石墨烯/烯烃嵌段共聚物/石蜡的导热率,但对热接触电阻的影响相对较弱。此外,提出了临界厚度,以定量评估热接触电阻的主导位置或r_(tims)的总热阻。它有助于在实际应用中进行定量分析和优化热阻。

著录项

  • 来源
    《International Journal of Heat and Mass Transfer》 |2020年第12期|120393.1-120393.8|共8页
  • 作者单位

    School of Mechanical and Energy Engineering Shaoyang University Shaoyang 422000 China Key Laboratory of Hunan Province for Efficient Power System and Intelligent Manufacturing Shaoyang University Shaoyang 422000 China;

    College of Engineering Shanghai Key Laboratory of Engineering Materials Application and Evaluation Shanghai Polytechnic University Shanghai 201209 China;

    College of Engineering Shanghai Key Laboratory of Engineering Materials Application and Evaluation Shanghai Polytechnic University Shanghai 201209 China;

    College of Engineering Shanghai Key Laboratory of Engineering Materials Application and Evaluation Shanghai Polytechnic University Shanghai 201209 China;

    Key Laboratory for Thermal Science and Power Engineering of Ministry of Education Department of Engineering Mechanics Tsinghua University Beijing 100084 China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Thermal contact resistance; Thermal conductivity; Phase change; Thermal interface materials; Critical thickness; Graphene;

    机译:热接触电阻;导热系数;相变;热界面材料;临界厚度;石墨烯.;

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