机译:考虑耦合应力的承载刚性微梁阵列的弹性板的厚度-剪切振动
Department of Mechanical and Materials Engineering, University of Nebraska. Lincoln, NE 68588, USA;
Department of Mechanics. Huazhong University of Science and Technology, Wuhan 430074, China;
Department of Mechanics. Huazhong University of Science and Technology, Wuhan 430074, China;
Department of Mechanical and Materials Engineering, University of Nebraska. Lincoln, NE 68588, USA;
State Key Laboratory of Digital Manufacturing Equipment & Technology, Huazhong University of Science and Technology, Wuhan 430074, China;
couple stress; plate; vibration;
机译:带有微束阵列的晶体板的剪切振动
机译:带有微束阵列的晶体板的剪切振动
机译:耦合了浸没在不粘液体中的微束覆盖的石英板谐振器的厚度-剪切振动的耦合分析和表面载荷引起的频移的计算
机译:圆形弹性板厚度-剪切振动的Mindlin板方程
机译:X射线微束研究弹性弯曲的硅梁和板中的抗弹性弯曲。
机译:磁力弹性非局部应变梯度板振动和屈曲的临界温度
机译:带环形板的环形板厚度剪切振动分析 mindlin板方程
机译:耦合厚度 - 剪切和厚度 - 扭曲振动的未电子aT切割石英板