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20-nm enhancement-mode metamorphic GaAs HEMT with highly doped InGaAs source/drain regions for high-frequency applications

机译:具有高掺杂InGaAs源/漏区的20-nm增强模式变质GaAs HEMT,适用于高频应用

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In this article, the DC and RF performance of a SiN passivated 20-nm gate length metamorphic high electron mobility transistor (MHEMT) on GaAs substrate with highly doped InGaAs source/drain (S/D) regions have investigated using the Synopsys TCAD tool. The 20-nm enhancement-mode (E-mode) MHEMT device also features -doped sheets on either side of the In0.53Ga0.47As/InAs/In0.53Ga0.47As channel which exhibits a transconductance of 3100 mS/mm, cut-off frequency (f(T)) of 740 GHz and a maximum oscillation frequency (f(max)) of 1040 GHz. The threshold voltage of the device is found to be 0.07V. The room temperature Hall mobilities of the 2-dimensional sheet charge density are measured to be over 12,600cm(2)/Vs with a sheet charge density larger than 3.6x10(12) cm(-2). These high-performance E-mode MHEMTs are attractive candidates for sub-millimetre wave applications such as high-resolution radars for space research, remote atmospheric sensing, imaging systems and also for low noise wide bandwidth amplifier for future communication systems.
机译:在本文中,使用Synopsys TCAD工具研究了具有高掺杂InGaAs源/漏(S / D)区域的GaAs衬底上SiN钝化的20 nm栅长变质高电子迁移率晶体管(MHEMT)的DC和RF性能。 20 nm增强模式(E模式)MHEMT器件还具有在In0.53Ga0.47As / InAs / In0.53Ga0.47As通道两侧的掺杂片,其跨导为3100 mS / mm,截止频率(f(T))为740 GHz,最大振荡频率(f(max))为1040 GHz。发现该器件的阈值电压为0.07V。二维薄板电荷密度的室温霍尔迁移率被测量为超过12,600cm(2)/ Vs,薄板电荷密度大于3.6x10(12)cm(-2)。这些高性能的E模式MHEMT非常适合亚毫米波应用,例如用于太空研究的高分辨率雷达,大气遥感,成像系统,以及用于未来通信系统的低噪声宽带放大器。

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